WMSIC Electronic Components

LPC1754FBD80K

ModelLPC1754FBD80K
Package80-LQFP(12x12)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP LPC1754FBD80K
Type
NXP
Unit
Electronic Component
Minimum package
595 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
LPC1754FBD80K
Electronic Component
1
Package
80-LQFP(12x12)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2.23g
CPU
32 Bit
CPU
ARM Cortex-M3
I / O
52
RAM
32KB
Electronic Component
1
Features
(BOR / LVD / LVR / LVI); positions(POR); Gate positions; Built-in General Purpose; positions(NRST)
Electronic Component
BM0258754771
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPC1754FBD80K 产品概述

一、产品简介

LPC1754FBD80K 为恩智浦(NXP)基于 ARM Cortex-M3 的 32 位微控制器,面向性能与低功耗平衡的嵌入式应用。核心主频最高可达 100 MHz,片内采用 128 KB FLASH 程序存储和 32 KB RAM,为中等复杂度的控制与通信任务提供充足资源。器件工作电压范围为 2.4 V 至 3.6 V,工作温度范围为 -40 ℃ 至 +85 ℃,适合工业级应用环境。

二、主要规格

  • CPU 内核:ARM Cortex-M3,32-bit
  • 最大主频:100 MHz
  • 程序存储:128 KB FLASH
  • 数据存储:32 KB RAM
  • 通用 I/O:52 个可用引脚
  • 振荡器:内置(简化时钟配置与快速启动)
  • 工作电压:2.4 V ~ 3.6 V
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:80 引脚 LQFP(12 mm × 12 mm)

三、片上资源与接口(概述)

LPC1754 所属家族通常配备丰富的片上外设,便于实现多种通信与控制功能。典型可用资源包括多路通用定时器、PWM 输出、ADC 通道以及常用总线接口(UART、SPI、I2C 等),能满足传感采集、位置/速度控制与与上位机通信的需求。52 路 I/O 为外设扩展和板上布线提供较大灵活性。

四、典型应用场景

  • 工业控制:电机驱动、PLC 扩展模块、数据采集与控制节点。
  • 物联网网关与边缘节点:负责传感器数据处理与通信协议转换。
  • 人机界面(HMI):中小型显示与按键交互控制。
  • 消费类智能设备与嵌入式产品原型开发。

五、设计注意事项

  • 电源与复位:保证供电稳定并使用合适去耦电容,防止复位误触发。
  • 时钟源策略:内置振荡器便于快速开发,但对精确时序或 USB/通信要求高的场合建议采用外部晶振(若设计允许)。
  • I/O 保护:工业环境下注意增加抗干扰与防护电路,如 TVS、滤波和串联阻抗。
  • FLASH 与 EEPROM 使用:合理安排程序与数据写入,避免频繁擦写影响寿命。

六、封装与机械信息

器件采用 80 引脚 LQFP 封装,外形尺寸 12 mm × 12 mm,适合中等密度 PCB 布局。封装引脚数量与排列方便外设引出与散热处理,适合量产 SMT 工艺。

七、开发与调试建议

  • 开发工具链:建议使用符合 ARM Cortex-M 的编译器与调试器,结合 JTAG/SWD 接口进行在线调试。
  • 引导与烧录:使用标准的 ISP/调试接口进行 FLASH 烧录与升级,设计板载调试接口便于固件迭代。
  • 软件架构:采用模块化驱动与中断/RTOS 管理策略,提高系统可靠性与可维护性。

八、小结

LPC1754FBD80K 以 Cortex-M3 的运算能力、128 KB FLASH 与 32 KB RAM 的存储配置,以及 52 路 I/O 的扩展能力,为中端嵌入式控制与通信应用提供了稳定的硬件平台。其宽电压与工业级温度范围使其在工业与商业产品中具有良好的适应性;在实际设计中注意电源、时钟与 I/O 保护即可发挥器件最佳性能。

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