WMSIC Electronic Components

MKE14Z64VLF4

ModelMKE14Z64VLF4
PackageLQFP-48(7x7)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP MKE14Z64VLF4
Type
NXP
Unit
Electronic Component
Minimum package
1250 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
MKE14Z64VLF4
Electronic Component
1
Package
LQFP-48(7x7)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.365g
CPU
32 Bit
CPU
ARM Cortex-M0+
I / O
42
RAM
8KB
Electronic Component
1
Features
Gate (IWDG); (BOR / LVD / LVR / LVI);; positions(POR); Gate positions; Built-in General Purpose; Built-in Temperature Sensor; CRC; positions(NRST); positions
Electronic Component
BM0265602228
Operating Temperature
40℃~+105℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MKE14Z64VLF4 产品概述

MKE14Z64VLF4是恩智浦(NXP)推出的一款基于ARM Cortex-M0+内核的32位微控制器(MCU),针对工业级应用及小型化智能设备设计,具备宽电压、宽温度范围、高集成度等特点,可满足多种场景下的稳定运行需求。

一、核心性能参数

该MCU采用ARM Cortex-M0+内核,是一款低功耗、高性能的32位架构,最大工作主频可达48MHz,兼顾运算效率与能耗控制。内核内置硬件乘法器,可支持快速算术运算,适合小型控制算法的实时执行。同时,芯片集成内置振荡器,无需外部晶振即可实现时钟功能,简化了硬件设计流程,降低了系统成本与体积。

二、存储器配置

MKE14Z64VLF4的存储器资源满足中等复杂度应用需求:

  • 程序存储器:64KB FLASH,可存储固件程序、系统校准数据、用户配置等,支持在线编程(ISP)与调试,便于产品后期升级;
  • 数据存储器:8KB SRAM,用于运行时变量存储、栈空间分配及临时数据缓存,可支撑小型控制逻辑、数据采集与处理任务。

三、I/O与外设资源

芯片提供42个通用I/O引脚,支持数字输入/输出、外部中断、定时器输入捕获/输出比较等功能,可满足多传感器接入、执行器控制等需求。虽未额外集成复杂外设(如ADC、UART等需结合具体子型号),但基础I/O资源充足,适合对基础控制接口需求较高的小型系统。

四、电源与工作环境

该MCU具备优异的环境适应性:

  • 电源电压:支持2.7V至5.5V宽范围输入,无需电平转换电路即可兼容5V系统,同时在低至2.7V的电池供电场景下仍能稳定工作,适合电池驱动的便携设备;
  • 工作温度:覆盖-40℃至+105℃工业级温度范围,可在极端温度环境(如户外工业现场、车载舱内等)下长期可靠运行,满足恶劣工况需求。

五、封装与应用场景

采用48-LQFP封装(尺寸7mm×7mm),引脚间距适中,便于手工焊接或自动化贴装,同时紧凑的体积适合小型化产品设计(如智能传感器节点、小型控制器等)。

典型应用场景包括:

  1. 工业小型控制系统(如电机转速控制、温度/湿度监测模块);
  2. 消费电子智能设备(如智能家居开关、户外便携监测仪);
  3. 汽车电子辅助单元(如胎压监测系统辅助模块、车载小功率控制);
  4. 医疗小型监测设备(如便携式生理参数采集仪)。

总结来看,MKE14Z64VLF4以其Cortex-M0+内核的低功耗优势、宽电压/宽温的工业级特性及紧凑封装,成为小型智能控制与监测系统的高性价比选择,尤其适合对成本、体积及环境适应性有要求的应用场景。

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