WMSIC Electronic Components

S9KEAZN64AMLCR

ModelS9KEAZN64AMLCR
Package32-LQFP(7x7)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP S9KEAZN64AMLCR
Type
NXP
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
S9KEAZN64AMLCR
Electronic Component
1
Package
32-LQFP(7x7)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.259g
CPU
32 Bit
CPU
ARM Cortex-M0+
I / O
28
RAM
4KB
Electronic Component
1
ADC
12bit
EEPROM
256Byte
Electronic Component
BM0257666041
Operating Temperature
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S9KEAZN64AMLCR 产品概述

一、产品简介

S9KEAZN64AMLCR 是恩智浦(NXP)推出的一款基于 ARM Cortex‑M0+ 内核的 32 位微控制器,最高主频 40 MHz。器件集成 64 KB Flash 程序存储、4 KB SRAM 和 256 Byte 的 EEPROM,适合对成本、功耗和可靠性有要求的嵌入式控制与传感应用。封装采用 32 引脚 LQFP(7×7 mm),工作电压范围 2.7 V 到 5.5 V,工业级工作温度 -40 ℃ 至 +125 ℃。

二、核心规格

  • 内核:ARM Cortex‑M0+,32 位,最高 40 MHz
  • 存储:64 KB Flash(程序存储器),4 KB SRAM(片上静态内存),256 Byte EEPROM
  • I/O:最多 28 个通用 I/O(GPIO)
  • 模数转换:12-bit ADC,适合多路传感器采集
  • 时钟:内置振荡器(系统无需外部晶振即可启动)
  • 电源与温度:工作电压 2.7 V–5.5 V;工作温度 -40 ℃–+125 ℃

三、外设与接口概览

器件在有限引脚资源下提供常用片上外设,能够满足多数控制与采集系统需求。典型外设包括多路数字 I/O、12‑bit ADC 通道用于传感器信号采集、低速串行接口(如 UART/SCI)、定时器/PWM 输出以及看门狗等基础功能。针对具体引脚复用和外设数量,请以器件数据手册为准。

四、封装与机械特性

该型号以 32‑LQFP(7×7 mm)封装形式供应,适合小型化的 PCB 设计与手工焊接或回流工艺。LQFP 封装便于散热和布局,适用于中低至中等复杂度的系统板级设计。

五、典型应用场景

  • 便携式仪表与数据采集终端:利用 12‑bit ADC 与内置 EEPROM 实现本地数据存储与采样
  • 工业控制与传感节点:耐工业温度与宽电压支持现场应用
  • 家用电器与白色家电控制:成本敏感且需可靠性的控制单元
  • 简单通信与人机界面控制:配合 UART、GPIO 驱动显示与按键

六、设计建议与注意事项

  • 电源设计:器件支持 2.7 V–5.5 V,设计时应保证稳压和足够的去耦电容以降低供电噪声对 ADC 精度的影响。
  • 时钟策略:内置振荡器可简化系统,但对高精度计时或通信稳定性有要求时,应考虑外部晶振或校准方案。
  • 存储管理:64 KB Flash 与 4 KB SRAM 适合中等复杂度固件,若需更大数据缓冲或复杂协议栈,应评估外部存储或更大容量器件。
  • 温度与可靠性:-40 ℃ 至 +125 ℃ 的工业级温度范围使其适合严苛环境,PCB 材料与封装应匹配实际工作条件以保证长期可靠性。
  • 开发资源:建议使用恩智浦提供的嵌入式开发工具链与示例代码,以缩短开发周期并保证驱动与外设初始化的正确性。

七、总结

S9KEAZN64AMLCR 将 Cortex‑M0+ 的简洁高效与 NXP 的工艺可靠性结合,凭借 64 KB Flash、4 KB SRAM、12‑bit ADC 及工业级电压/温度特性,适合成本敏感且需长期稳定运行的嵌入式应用。选型时请结合目标系统的性能、存储与外设需求,并参照具体数据手册与应用说明书完成硬件与软件设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.