WMSIC Electronic Components

PCA9554ABS3,118 PCA9554ABS3

ModelPCA9554ABS3,118
PackageHVQFN-16-EP(3x3)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP PCA9554ABS3, 118
Type
NXP
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCA9554ABS3,118
Electronic Component
1
Package
HVQFN-16-EP(3x3)
Electronic Component
I / O Expander
Electronic Component
0.056g
Electronic Component
1
I / O
8
Features
positions; and
Electronic Component
BM0257222783
Operating Temperature
40℃~+85℃
Operating Voltage
2.3V~5.5V
Interface Type
I2C;SMBus
Output Type
Electronic Component
Current(IOH)
10mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCA9554ABS3,118 产品概述

一、产品简介

PCA9554ABS3,118 是恩智浦(NXP)推出的一款 8 位 I/O 扩展器,兼容 I2C 与 SMBus,总线速率最高可达 400 kHz。器件封装为 HVQFN-16-EP (3x3),工作电压范围宽(2.3V–5.5V),工作温度为 -40℃ 至 +85℃,适合工业级和便携式电源应用。器件内置中断输出(开漏,活动低),支持最多 8 个从设备地址,便于多器件扩展。

二、主要特性与电气参数

  • 接口:I2C / SMBus,最大时钟频率 fc = 400 kHz
  • I/O 数量:8 位通用 I/O
  • 输出类型:开漏(需要外部上拉)
  • 中断:有中断输出,活动低,开漏结构
  • 支持设备数量:最多 8 个地址组合
  • 工作电压:2.3 V ~ 5.5 V
  • 静态电流 Iq:典型 250 nA(低功耗待机)
  • 输出驱动能力:下拉电流 IOL = 24 mA;上拉等效 IOH = 10 mA
  • 电平性能:VOH = 4 V(在规定条件下);VOL = 400 mV(在规定条件下)
  • 封装:HVQFN-16-EP (3x3)

三、功能说明

PCA9554 提供独立的寄存器用于配置方向、输出寄存、输入读取及极性反转。开漏输出非常适合驱动低侧负载或与不同电压域的设备接口(需配合上拉电阻)。当任一输入/输出状态变化触发中断时,器件通过 INT 引脚通知主控,降低主控轮询开销,有利于节能系统设计。

四、典型应用场景

  • MCU/FPGA 的 GPIO 扩展,用于按键矩阵、开关和状态指示
  • LED 灯驱动(低侧驱动模式,注意限流)与信号灯控制
  • 电源管理、系统监控中的状态采集与中断告警
  • 工业自动化、通信设备及消费类电子的 I/O 扩展

五、设计与使用建议

  • 由于输出为开漏结构,应根据总线速度与负载选择合适的上拉电阻;快速通信或大电流场景需加大上拉电流能力。
  • 当多个器件共用同一总线并接入不同 Vcc 时,注意 I/O 侧的电平兼容与可能的电平移位需求。
  • 高频工作时在 Vcc 引脚加 0.1 μF 陶瓷去耦,器件热沉脚(EP)需焊接良好以保证散热和电气性能。
  • 若驱动近 24 mA 的负载,建议评估封装温升并尽量分散负载以避免单引脚过热。

PCA9554ABS3,118 以其低静态电流、宽电压范围与可靠的中断机制,适合对 GPIO 数量与功耗有严格要求的系统,是一种常见且可靠的 I2C/SMBus I/O 扩展解决方案。

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