WMSIC Electronic Components

SA56004ED,118 SA56004ED

ModelSA56004ED,118
PackageSO-8
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP SA56004ED, 118
Type
NXP
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
SA56004ED,118
Electronic Component
1
Package
SO-8
Electronic Component
Temperature Sensor
Electronic Component
±2℃
Electronic Component
0.2g
Electronic Component
1
Features
Output; Low Power
Electronic Component
BM0234453026
Operating Voltage
3V~5.5V
Current
10uA
Interface Type
SMBus;I2C
Electronic Component
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SA56004ED,118 产品概述

一、产品简介

SA56004ED,118 是恩智浦(NXP)系列的数字温度传感器,测量范围覆盖 -40℃ 到 +125℃,工作电压为 3.0V 到 3.6V。器件通过 I2C 总线(兼容 SMBus)进行数字通信,采用 SO-8 封装,适合在多种电子系统中实现精确的温度监测与热管理控制。该器件以小体积、易集成和数字接口为主要卖点,适用于需要可靠温度数据的场合。

二、主要特性

  • 测量温度范围:-40℃ ~ +125℃,适应工业级环境温度需求。
  • 工作电压:3.0V ~ 3.6V,适配常见单电源系统(注意在设计中保证电源稳定)。
  • 通信接口:I2C(兼容 SMBus),支持主从式总线拓扑,便于与 MCU、PMIC 等主控器件连接。
  • 封装:SO-8(小外形,便于贴片加工和批量生产)。
  • 数字输出:直接返回数字温度值,简化上位机运算与校准步骤(具体分辨率与精度请以官方数据手册为准)。

三、典型应用

  • 电池管理与电源系统:监测电池或电源温度,配合充放电策略保证安全。
  • 工业设备与控制器:机箱或关键器件温度监测,支持温控与故障报警。
  • 通信与服务器设备:用于热管理、风扇控制和过温保护。
  • 消费电子与家用电器:在对温度敏感的模块处实现精确温度采样。

四、封装与引脚

器件采用 SO-8 封装,适合标准 PCB 贴片工艺。典型设计应参考器件数据手册中的引脚功能说明,确认电源、地、I2C 数据线(SDA/SCL)以及任何中断/警报引脚的连接方式。SO-8 的热阻相对较大,温度测量受 PCB 热传导影响,应在布局时考虑热耦合与隔离。

五、设计建议与实施注意事项

  • 电源管理:保证 VCC 在 3.0V~3.6V 范围内并具备良好去耦(如靠近 VCC 引脚放置 0.1µF 陶瓷电容)。
  • I2C 总线:SDA/SCL 需接上拉电阻到器件 VCC(上拉阻值根据总线速率与总线负载选择,常见为 2.2kΩ~10kΩ)。若系统电压不同,应采用电平移位或选择适配方案。
  • 布局与热考虑:若测量环境要求代表某一元件温度,应将传感器靠近被测器件;若需测环境温度,应避免靠近热源或功率器件,以降低误差。避免在传感器下方放置大面积铜箔以免影响热响应。
  • EMC 与 ESD:在敏感应用中推荐在 I2C 信号线上加施加适当保护,注意静电防护与 PCB 接地策略。
  • 校准与验证:出货前对关键应用场景进行温度校验,必要时在软件端做偏移校准以满足系统精度要求。
  • 查询数据手册:具体的电气特性、时序、地址设定、精度与分辨率等详细参数应以官方数据手册为准,设计前请下载并确认最新版本。

六、采购与替换建议

选型时注意器件完整型号(含尾码)与生产批次以确保性能一致。若需替换或对比,请查阅功能与电气参数是否完全兼容,特别是工作电压、接口逻辑、I2C 地址和封装脚位。对于批量采购可咨询授权分销商或厂商获取长期供货与技术支持。

如需进一步的引脚图、时序图或电气参数解析,可提供所需的应用场景或索取官方数据手册,我可为您做更细化的设计建议与布局优化。

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