WMSIC Electronic Components

MC9S08PA4AVTG

ModelMC9S08PA4AVTG
PackageTSSOP-16
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP MC9S08PA4AVTG
Type
NXP
Unit
Electronic Component
Minimum package
96 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
MC9S08PA4AVTG
Electronic Component
1
Package
TSSOP-16
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.001g
CPU
S08
I / O
14
Electronic Component
1
ADC
12bit
Electronic Component
BM0233540422
Operating Voltage
2.7V~5.5V
CPU
20MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MC9S08PA4AVTG 产品概述

一、概述

MC9S08PA4AVTG 是恩智浦(NXP)基于S08内核的小容量单片机,面向成本敏感、体积受限的嵌入式控制场景。器件工作电压范围为2.7V~5.5V,CPU最大主频20MHz,程序存储容量4KB,封装为TSSOP-16,提供最多14路可用I/O。内置12位ADC,能够满足对分辨率有一定要求的模拟量采集应用。

二、核心规格

  • 品牌:NXP(恩智浦)
  • 型号:MC9S08PA4AVTG
  • CPU内核:S08
  • 最大主频:20MHz
  • 程序存储(Flash):4KB
  • 工作电压:2.7V ~ 5.5V
  • I/O数量:14(通用数字I/O)
  • ADC精度:12-bit(内置模数转换器)
  • 封装:TSSOP-16

三、主要特性与优势

  • 低功耗与宽电压工作:支持2.7V至5.5V供电,适应电池供电及工业电源场景,便于电源设计与系统兼容。
  • 适度运算能力:20MHz主频在多数简单控制与实时响应任务中具有充分性能,能实现逻辑控制、状态机、定时与简单算法处理。
  • 精细模拟采集:集成12位ADC,提供较高的采样分辨率,适合传感器信号采集、环境监测与电压/电流测量等应用。
  • 紧凑封装与I/O资源:TSSOP-16小尺寸封装利于空间受限产品,14路I/O可实现一般控制与通讯引脚分配。
  • 成本与集成度平衡:4KB程序空间适合轻量级固件,适配成本敏感型产品和一次性/抛弃式终端。

四、典型应用场景

  • 传感器数据采集与前端处理:环境、温湿度、气体或简单多通道传感器采样。
  • 工业/家电控制:按键面板、继电器驱动、状态指示与简单的用户界面。
  • 电池供电便携设备:低功耗待机与间歇采样场景。
  • 教育与快速原型:作为学习S08内核与基础外设的入门型单片机。

五、设计注意事项与建议

  • 电源与去耦:在2.7V–5.5V的宽电压范围内,建议在VDD近端放置适当的旁路电容(如0.1µF),并根据应用增加滤波与稳压措施。
  • IO驱动能力评估:根据外设负载选择合适的驱动器或缓冲,以免超出单片机IO能力。
  • ADC输入保护与滤波:对于高精度采样,应加输入滤波、抗混叠电路与参考源稳定化,避免噪声影响转换结果。
  • PCB布局:TSSOP-16封装利于密集布局,但需注意热管理与信号线短路、串扰问题。

六、开发与支持

恩智浦对S08系列提供配套的开发与调试支持,建议使用官方或第三方的编译器和调试器进行固件开发与在目标板上验证。选型时可结合所需外设、程序空间与系统扩展需求,评估MC9S08PA4AVTG在产品生命周期内的适配性与可维护性。

总结:MC9S08PA4AVTG以其宽电压、12-bit ADC、14路I/O和紧凑TSSOP-16封装,为对成本和尺寸敏感、同时又需要一定模拟采集能力的嵌入式应用提供了实用选择。

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