Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MC9S08PA16AVLC
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- NXP MC9S08PA16AVLC
- Type
- NXP
- Unit
- Electronic Component
- Minimum package
- 1250 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- MC9S08PA16AVLC
- Electronic Component
- 1
- Package
- LQFP-32(7x7)
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 3.4g
- CPU
- 8 Bit
- CPU
- S08
- I / O
- 28
- RAM
- 2KB
- Electronic Component
- 1
- ADC
- 12bit
- EEPROM
- 256Byte
- Features
- (BOR / LVD / LVR / LVI);; positions(POR); Gate positions; Built-in General Purpose; CRC
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MC9S08PA16AVLC 产品概述
一、产品简介
MC9S08PA16AVLC 是恩智浦（NXP）基于 S08 内核的 8 位单片机，最高主频 20MHz。器件采用 16KB Flash 程序存储、2KB SRAM、256B EEPROM，内置振荡器，工作电压范围宽（2.7V～5.5V），工作温度范围 -40℃～+105℃，封装为 LQFP-32（7x7），提供 28 个 I/O，可满足多类低功耗、成本敏感的嵌入式控制应用。
二、主要规格亮点
- CPU：S08 8 位核心，最高 20MHz。
- 存储：16KB Flash（程序）、2KB RAM、256B EEPROM（非易失性数据存储）。
- 模拟性能：12 位 ADC，适合对传感器信号进行中高精度采样。
- 电源与温度：2.7V～5.5V 供电，-40℃～+105℃ 工业级温度范围。
- 引脚与封装：28 个 I/O，LQFP-32（7x7）封装，便于 PCB 布局与焊接。
三、硬件资源与应用适配性
丰富的片上资源（Flash/RAM/EEPROM）适合运行中小型应用程序，并在掉电或需保存参数时使用 EEPROM。12 位 ADC 能满足温度、压力、光照等模数信号采集需求。28 路 I/O 可驱动键盘、LED、继电器或与外设通讯的控制线路。20MHz 主频与 8 位架构适合低成本控制、定时、简单通讯与信号处理场景。
四、典型应用场景
- 便携仪器与手持终端（低电压单电池供电）
- 工业传感与过程控制（-40℃～+105℃ 适用）
- 家电与白色家电控制板（按键、显示、温度采集）
- 汽车车身电子（符合温度与电压要求的次级控制）
- 简单电机/步进控制与电源管理
五、设计注意要点
- 内部振荡器可简化外部晶振设计，但对精度有要求时建议外部晶振或校准。
- 细心管理 RAM 和 EEPROM 使用，注意 EEPROM 擦写寿命与写入策略。
- 做好电源去耦、复位电路与电磁兼容（ESD）防护，保证在宽电压范围下稳定运行。
- LQFP-32 封装在布线时注意地线回路与散热，保持 ADC 输入的参考与接地稳定。
六、开发与支持
该系列可利用恩智浦及第三方提供的开发工具链、编译器与调试器进行应用开发。建议参考官方数据手册与参考设计以优化启动、系统时钟与外设配置。
七、小结
MC9S08PA16AVLC 是一款面向工业与消费级嵌入式控制的低成本、低功耗 8 位 MCU。其 16KB Flash、2KB RAM、256B EEPROM 与 12 位 ADC 在满足基本控制与采集需求的同时，2.7V～5.5V 的供电范围和 -40℃～+105℃ 的工作温度使其具备良好的环境适应性。适合对成本、可靠性和封装空间有综合要求的产品设计。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
