WMSIC Electronic Components

UJA1163ATK/0Z UJA1163ATK

ModelUJA1163ATK/0Z
PackageHVSON-14-EP(3x4.5)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP UJA1163ATK / 0Z
Type
NXP
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
UJA1163ATK/0Z
Electronic Component
1
Package
HVSON-14-EP(3x4.5)
Type
CAN Transceiver
Electronic Component
CAN Transceiver
Electronic Component
0.4g
Electronic Component
1
Features
ESD; TXD; Low Power; Integrated Power Supply; Bus
Electronic Component
BM0257268284
Operating Temperature
40℃~+150℃
Operating Voltage
4.9V~5.1V
Operating Current
67mA
Data
5Mbps
Static Current
91uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

UJA1163ATK/0Z 产品概述

一、产品简介

UJA1163ATK/0Z 是恩智浦(NXP)系列的 CAN 收发器,封装为 HVSON-14-EP(3×4.5 mm),定位为用于车载及工业环境的差分总线物理层器件。该器件可实现 MCU 与 CAN 总线之间的电平与差分信号转换,适用于对速率、可靠性及工作温度有严格要求的系统设计。

二、主要规格(基础参数)

  • 类型:CAN 收发器(1:1 配置,14 引脚 HVSON)
  • 数据速率:最高 5 Mbps
  • 工作电压:4.9 V ~ 5.1 V(典型 5 V 供电)
  • 工作电流:67 mA(典型运行电流)
  • 静态电流(待机):91 μA
  • 工作温度范围:-40 ℃ ~ +150 ℃
  • 封装:HVSON-14-EP(3 × 4.5 mm)
  • 描述:收发器-1-1-CAN-14-HVSON(3x4.5)
  • 品牌:NXP(恩智浦)

三、关键特性与优势

  • 高速通信:支持高达 5 Mbps 的数据速率,满足高速 CAN 或特殊高速链路的传输需求。
  • 宽温适应性:器件工作温度覆盖 -40 ℃ 至 +150 ℃,适合严苛车规和工业现场环境。
  • 低静态功耗:待机静态电流仅 91 μA,有利于系统休眠与节能管理。
  • 紧凑封装:HVSON-14-EP 小尺寸封装便于高密度 PCB 布局,同时暴露焊盘(EP)有助于散热与机械强度。
  • 稳定性与兼容性:作为恩智浦产品,常见于汽车电子与工业控制领域,可与常用 MCU/控制器的 CAN 控制器层兼容。

四、典型应用场景

  • 车载网络(车身控制、诊断通道、域控制器间通信)
  • 工业自动化现场总线与控制系统
  • 运输与工程机械的控制与监控网络
  • 需要高温、狭小空间及高可靠性环境的差分总线接口

五、设计与布局建议

  • 供电旁路:在 VCC 近旁布置 0.1 μF 陶瓷旁路电容并配合 1 μF~10 μF 的稳态电容,抑制瞬态电流。
  • 差分线与终端:CAN_H/CAN_L 线路应走差分对,长度匹配并保持恒定阻抗;总线两端采用 120 Ω 终端电阻或按系统要求配置。
  • EMC 与保护:建议在总线上配合共模电感、TVS 或浪涌保护器件提升抗干扰与过压能力。
  • 封装焊盘与散热:HVSON-14 的暴露焊盘(EP)应焊接到 PCB 对地铜箔以优化散热与可靠性;注意回流工艺与焊盘注锡量控制。
  • 热设计:运行电流 67 mA 在高温环境时需评估 PCB 散热路径,必要时增加散热铜层或散热夹具。

六、选型与可靠性提示

在选用 UJA1163ATK/0Z 时,应确认系统供电在 4.9–5.1 V 范围内并考虑过压/欠压保护;对于严苛环境建议参考恩智浦的器件说明书和应用笔记,结合 EMC、ESD 及功能安全要求做完整验证。HVSON 小封装对手工焊接不友好,生产时建议采用回流焊与在线测试流程以保证良率与可靠性。

如需进一步的电气参数、读数曲线或封装引脚图,请参考恩智浦官方数据手册或提供进一步的具体设计要求以便给出更精确的支持与建议。

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