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LPC5528JBD64Y
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP LPC5528JBD64Y
- Type
- NXP
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- LPC5528JBD64Y
- Electronic Component
- 1
- Package
- SOT-855-5
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0.761g
- CPU
- 32 Bit
- CPU
- ARM Cortex-M33
- I / O
- 36
- RAM
- 256KB
- Electronic Component
- 1
- Features
- Gate (WWDG); (BOR / LVD / LVR / LVI);;; positions(POR); Generator (TRNG); Built-in General Purpose; Built-in Temperature Sensor; CRC
- Electronic Component
- BM0262715335
- Operating Temperature
- 40℃~+105℃
- Operating Voltage
- 1.8V~3.6V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LPC5528JBD64Y 产品概述
一、核心规格与性能
LPC5528JBD64Y 基于 ARM Cortex‑M33 内核，32 位架构，最高主频可达 150 MHz，适合对实时性和能效有较高要求的嵌入式应用。内核性能结合片内总线与外设设计，可在控制和信号处理场景中提供稳定、低延迟的计算能力。
二、存储与电源
器件配备 512 KB 闪存（FLASH）用于程序存储和非易失性数据保存，片内 SRAM 为 256 KB，满足中大型固件和运行时数据缓冲需求。工作电压范围为 1.8 V 至 3.6 V，适配多种电源方案并支持低功耗运行策略。
三、外设与时钟
I/O 引脚数量约 36 个，可灵活配置为 GPIO 或多种外设功能（UART、SPI、I2C 等常见接口在实际产品中支持）。振荡器支持片内与外置时钟源，便于实现精确时间基准与低功耗待机时钟管理，利于通信同步与计时应用。
四、封装与环境适应性
该器件常见封装为 64 引脚 HTQFP（HTQFP64），用户提供信息中另列有 SOT‑855‑5，封装信息请以官方数据手册为准。工作温度范围为 -40℃ 至 +105℃，适用于工业级温度环境，可靠性适配更广泛的现场应用。
五、应用场景
LPC5528JBD64Y 适用于工业控制、智能传感、物联网边缘节点、消费类电子和通信设备的微控制与协议栈实现。凭借较大的片内 RAM/FLASH 与丰富的 I/O，它在需要本地数据处理、加密通信或多协议桥接的方案中具有竞争力。
六、选型建议与注意事项
在选型时建议核对官方数据手册以确定外设列表、电气参数和封装细节；评估系统功耗预算时关注片内低功耗模式与振荡器策略；若需更高安全或外设集成度，可比较同系列不同封装和配置的器件，确保外围资源与 PCB 布局满足信号完整性与热管理要求。
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