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TEA2095T/1/S30J TEA2095T
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
15
specifications
Core information
- Product name
- NXP TEA2095T / 1 / S30J
- Type
- NXP
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- TEA2095T/1/S30J
- Electronic Component
- 1
- Package
- SOP-8
- Electronic Component
- Synchronous Rectifier Controller
- Electronic Component
- 0.184g
- Electronic Component
- 1
- Features
- Synchronous
- Electronic Component
- BM0234669377
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TEA2095T/1/S30J 产品概述
一、概述
TEA2095T/1/S30J 是恩智浦（NXP）推出的一款用于有源/同步整流控制的 AC‑DC 控制器/稳压器，封装为 SOP‑8 表面贴装型。器件工作结温范围宽，-40°C 至 +125°C（TJ），供电电压范围为 4.75V ～ 38V，静态供电电流仅约 90µA，适用于对效率和待机功耗有严格要求的电源系统。
二、主要特性
- 宽输入供电电压：4.75V ～ 38V，能适应多种整流网络和中间母线电压。
- 极低供电电流：典型值 90µA，有利于降低待机损耗和提高系统能效。
- 工作温度范围：-40°C ～ +125°C（结温 TJ），满足工业级和汽车电子级环境要求。
- 封装：SOP‑8 表面贴装，便于自动化组装与散热设计。
- 主要应用：有源/同步整流控制器，用于提升 AC‑DC 及开关电源整流端效率。
三、功能说明
TEA2095T/1/S30J 用于替代传统二极管整流，控制外部功率 MOSFET 在整流阶段同步导通以降低导通损耗。器件内置比较与时序控制电路，用于检测整流极性和实现可靠的死区时间管理，防止器件因导通重叠而产生的直通（shoot‑through）。低电流特性使其非常适合要求低待机功耗的适配器、LED 驱动及消费类电源。
四、典型应用场景
- 台式/笔记本电源适配器、充电器
- 服务器与通信电源的整流前端
- LED 驱动器与工业电源模块
- 高效率开关电源（SMPS）及备用电源方案
五、设计与布局建议
- 电源去耦：在 IC 供电引脚近旁放置低 ESR 陶瓷电容以保证瞬态稳定。
- 门极驱动：与 MOSFET 配合时应选用适当门阻，控制开关速度以兼顾 EMI 与开关损耗。
- 散热与封装：SOP‑8 为表贴封装，注意 PCB 铜箔与过孔布置以改善散热和热阻。
- 保护措施：在系统层面配合过流、过压和过温保护电路，以提升整机可靠性。
六、优势小结
TEA2095T/1/S30J 以其宽电压范围、极低供电电流与工业级温度能力，为高效率 AC‑DC 系统提供经济且可靠的同步整流控制解决方案。标准 SOP‑8 封装便于量产与系统集成，是替代整流二极管、提升转换效率、降低系统热负载的优选器件。
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