WMSIC Electronic Components

MIMX8ML8CVNKZAB

ModelMIMX8ML8CVNKZAB
Package568-LFBGA
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
NXP MIMX8ML8CVNKZAB
Type
NXP
Unit
Electronic Component
Minimum package
126 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
MIMX8ML8CVNKZAB
Electronic Component
1
Package
568-LFBGA
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2.8g
Electronic Component
1
Electronic Component
BM0263482628
CPU
1.6GHz
Electronic Component
Electronic Component
Electronic Component
126

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MIMX8ML8CVNKZAB 产品概述

一、产品简介

MIMX8ML8CVNKZAB 是恩智浦(NXP)推出的一款高性能单片机/应用处理器(MCU/MPU/SoC),芯片 CPU 最高主频可达 1.6 GHz,封装形式为 568-LFBGA。该器件面向需要并行计算、多媒体处理与安全控制的嵌入式系统设计,兼顾算力与能耗效率,适合工业与消费类终端产品。

二、核心性能

芯片以提高单核/多核执行效率为目标,在 1.6 GHz 的主频下可支撑复杂操作系统与实时应用同时运行。片上通常集成片上总线、高速缓存与功耗管理单元,以优化性能调度与系统响应时间,适合运行 Linux、RTOS 或混合软件堆栈。

三、封装与机械特性

采用 568-ball LFBGA 封装,提供较高的引脚密度与电气性能,便于实现高速信号布线与复用外设。LFBGA 封装在热阻与机械可靠性方面有良好表现,适合工业级温度与长期运行场景,但在 PCB 布局与散热设计上需预留足够的散热通道与地平面。

四、外设与接口(典型)

为满足多类应用需求,该类 SoC 通常支持丰富外设接口:通用串口(UART)、SPI、I2C、PWM、ADC、以太网、USB、SD/MMC/eMMC 存储接口、音频接口与显示控制器等。同时常见集成安全模块(安全引导、加密加速)与硬件视频/图形加速单元,便于实现人机界面与媒体处理功能。

五、电源与散热考虑

器件在高负载下功耗会上升,需结合板级电源管理(PMIC)与多电源轨设计,保证核电压、外设电压与 I/O 电压稳定。散热方案可采用铜箔散热、热过孔和金属散热片,必要时在 PCB 设计中增加散热通道与热沉以保证长期可靠性。

六、典型应用场景

适合用于工业控制器、人机界面(HMI)、智能网关、边缘计算设备、音视频流处理与物联网网关等。凭借较高主频与封装密度,可在需要实时响应与多媒体支持的场景中提供良好表现。

七、开发支持与注意事项

恩智浦生态通常提供软件开发包(SDK)、板级支持包(BSP)和参考设计,配合调试工具可快速验证功能。设计时应注意:合理规划外设引脚复用、评估功耗模式与电源完整性、预留安全与固件升级机制、并根据封装要求优化 PCB 布局和散热。若面向量产,还需评估温度范围、EMC 合规与长期可靠性测试方案。

总结:MIMX8ML8CVNKZAB 以 1.6 GHz 主频与 568-LFBGA 封装为基础,面向需要高集成度与多功能外设支持的嵌入式应用,提供良好的性能/功耗折衷与工业级设计能力。

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