WMSIC Electronic Components

LPC11U37FBD48/401 LPC11U37FBD48

ModelLPC11U37FBD48/401
PackageLQFP-48(7x7)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP LPC11U37FBD48 / 401
Type
NXP
Minimum package
100 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
LPC11U37FBD48/401
Electronic Component
1
Package
LQFP-48(7x7)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
3.86g
CPU
32 Bit
CPU
ARM Cortex-M0
I / O
40
RAM
10KB
Electronic Component
1
EEPROM
4KB
Electronic Component
BM0265088243
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~3.6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPC11U37FBD48/401 产品概述

一 产品简介

NXP(恩智浦)LPC11U37FBD48/401 是一款基于 ARM Cortex‑M0 内核的 32 位微控制器,最高主频 50 MHz。器件提供 128 KB 的 Flash 程序存储、10 KB SRAM、4 KB EEPROM,内置振荡器,工作电压范围 1.8 V 至 3.6 V,工作温度范围 -40 ℃ 至 +85 ℃,封装为 LQFP‑48(7×7),I/O 引脚数约 40 个,适合中小型嵌入式控制和通信类应用。

二 主要规格(要点)

  • CPU 内核:ARM Cortex‑M0,32 位,最高 50 MHz
  • 存储:128 KB Flash;10 KB RAM;4 KB EEPROM
  • I/O:约 40 个通用 I/O 引脚
  • 时钟:内置振荡器(可用于省略外部晶振以简化设计)
  • 电源:工作电压 1.8 V ~ 3.6 V
  • 温度:工业级 -40 ℃ ~ +85 ℃
  • 封装:LQFP‑48(7×7)
  • 品牌:NXP(恩智浦)

三 特性与优势

  • Cortex‑M0 内核功耗低、指令集精简,适合对成本和能耗敏感的嵌入式系统。
  • 128 KB Flash 与 4 KB EEPROM 的组合便于保存程序与少量持久配置数据。
  • 宽电压范围和工业级温度使器件适用于电池供电与现场工业环境。
  • LQFP‑48 封装兼顾引脚数量与 PCB 布局空间,便于原型与量产。

四 典型应用场景

  • 工业控制与数据采集终端(低速传感器、I/O 控制)
  • 低功耗消费电子产品与便携设备控制板
  • 简单通信网关、串口/总线适配器(与外设协同)
  • 教育与原型开发平台

五 设计与使用建议

  • 电源:靠近 VDD 引脚放置 0.1 μF 陶瓷去耦电容并配合 1 μF~10 μF 旁路电容以保证瞬态性能;注意 1.8 V 与 3.3 V 电源域的设计。
  • 时钟:内置振荡器适合大多数用途;若需更高时钟精度或 USB 等外设,建议外接晶振(视外设需求)。
  • I/O 与地:模拟信号与数字信号应分区布线,ADC/VREF(若使用)靠近地平面,减少噪声干扰。
  • 编程与调试:预留 SWD/JTAG 接口脚位与调试器连接点;在量产时考虑 ISP/DFU 或单片机自带引导模式的固件升级方案。
  • ESD 与保护:外部接口添加 TVS 二极管和串联限流等措施,保护 I/O 引脚和电源免受冲击。

六 封装与布局注意

LQFP‑48(7×7)封装适合手工焊接与自动贴装。布板时注意将电源/地环路尽量做短、为散热提供足够的地铜铺,若功耗较高可考虑在地平面开窗或增加散热通孔以提升热传导。

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