Model & package intelligence
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UJA1169TK/X/FZ UJA1169TK
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
14
specifications
Core information
- Product name
- NXP UJA1169TK / X / FZ
- Type
- NXP
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- UJA1169TK/X/FZ
- Electronic Component
- 1
- Package
- 20-HVSON（3.5x5.5）
- Electronic Component
- Specialized Power Management(PMIC)
- Electronic Component
- 0.08g
- Electronic Component
- 1
- Electronic Component
- BM0264935312
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
UJA1169TK/X/FZ 产品概述
一、功能概述
UJA1169TK/X/FZ 是恩智浦（NXP）面向车载与工业接口应用的系统基础芯片（System Basis Chip），属于接口类器件。器件集成电源管理、通信接口仲裁与故障保护等功能，支持工作状态指示、上电时序控制与过流保护等关键特性，能够作为MCU 与外部网络（例如CAN、LIN 或其它通信总线）之间的可靠桥梁，简化系统设计并提升整机鲁棒性。
二、主要特性
- 工作状态指示：提供清晰的状态输出，用于指示供电、故障、通信活动等，便于系统诊断与灯号驱动。
- 上电时序控制：内建电源及复位管理，保证多个电源域和外设的有序上电/复位，避免启动冲突与总线误动作。
- 过流保护：集成电流监测与限流/关断机制，能在短路或突发过流条件下保护器件与外部负载。
- 综合诊断与保护：通常包含欠压、过压、短路、热关断等保护功能，提高系统可靠性。
- 高度集成：将电源管理、接口驱动与诊断功能集中，减小BOM、降低PCB空间需求。
三、封装与热管理
该器件采用 20‑引脚 HVSON（3.5 mm × 5.5 mm）封装，适合表面贴装工艺。HVSON 封装利于热量通过底部散热垫传导至PCB，设计时应为散热垫布置足够的过孔与铜面，并遵循厂商推荐的焊盘尺寸与过孔布局以保证散热与可靠焊接。
四、典型应用场景
- 汽车车身电子与车门控制单元（BCM）
- 车载网关与网路接口板（CAN/LIN 等）
- 传感器与执行器控制模块的电源与接口管理
- 工业控制器与通讯接口板，要求上电序列与过流保护的系统
五、设计与使用建议
- 严格参照恩智浦数据手册的上电/上电序列、去耦电容与布局建议，确保器件功能稳定。
- 在电源输入、通信线及状态指示输出处加入必要的滤波与保护电路以满足EMC/ESD 要求。
- 底部散热垫需与多层铜箔良好连通，并在PCB设计中考虑热回流与散热过孔。
- 在系统级调试时重点验证上电时序与过流保护触发响应，保证在异常条件下系统能安全进入降级或断电保护态。
总结：UJA1169TK/X/FZ 作为高度集成的系统基础芯片，适用于对上电控制与故障保护有严格要求的车载与工业接口场景，可有效降低系统复杂度并提升可靠性。具体电气参数和使用规范请以恩智浦最新数据手册为准。
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