WMSIC Electronic Components

S9S08DZ60F2MLFR

ModelS9S08DZ60F2MLFR
PackageLQFP-48(7x7)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP S9S08DZ60F2MLFR
Type
NXP
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
S9S08DZ60F2MLFR
Electronic Component
1
Package
LQFP-48(7x7)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.19g
CPU
8 Bit
CPU
S08
I / O
39
RAM
4KB
Electronic Component
1
ADC
12bit
EEPROM
2KB
Features
(BOR / LVD / LVR / LVI);; positions(POR); Gate positions; Built-in General Purpose; Built-in Temperature Sensor; positions(NRST)
Electronic Component
BM0231119743

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S9S08DZ60F2MLFR 产品概述

一、产品简介

S9S08DZ60F2MLFR 为恩智浦(NXP)S08系列单片机,基于8位S08内核,最高主频40MHz。器件采用LQFP-48(7x7mm)封装,支持外置振荡器驱动,工作电压范围宽(2.7V~5.5V),工作温度覆盖工业级需求(-40℃~+125℃)。适合对成本、可靠性和工业温度有要求的嵌入式控制与数据采集应用。

二、主要特性

  • CPU:S08 内核,8位,最高40MHz 主频,适合实时控制与简单算法运算。
  • 存储:60KB Flash 程序存储、4KB RAM 数据存取、2KB EEPROM 用于非易失性参数保存。
  • 外设与引脚:39 个通用 I/O 引脚,满足传感器、驱动器及外设接口布线需求。
  • 模数转换:内置12bit ADC,提供较高分辨率的模拟信号采集能力,适用于精度要求较高的测量场合。
  • 时钟与电源:采用外置振荡器方案以获得更稳定时钟;工作电压2.7V~5.5V,便于与多种传感器和驱动器兼容。
  • 可靠性:工业温度等级(-40℃~+125℃),适用于恶劣环境下长期可靠工作。

三、典型应用场景

  • 工业控制:电机控制小型驱动、PLC 辅助控制、设备状态监测。
  • 数据采集:带有多个模拟输入的传感器节点、测量与记录设备。
  • 家电与消费类电子:控制面板、按键解码、显示驱动与通信桥接。
  • 汽车车身电子(非安全关键):车内环境监测与控制(需符合系统级车规要求)。

四、设计建议与注意事项

  • 电源与去耦:在 VDD 附近放置 0.1µF 与 1µF 去耦电容,靠近芯片引脚布局,保证瞬态响应。
  • ADC 布局:模拟输入走线尽量短且远离数字高速信号,必要时加低通滤波与缓冲放大器。
  • 时钟源选择:外置振荡器需保证频率稳定与低相位噪声,以提高模拟测量与通信稳定性。
  • 温度与封装:LQFP-48 支持焊接工艺,注意散热与焊盘设计,工业温度下确保元件余量与应力控制。
  • 固件与存储管理:60KB Flash 与 4KB RAM 适合中等复杂度固件,建议规划好 EEPROM 的写次数与参数保存策略。

五、封装与供应信息

封装:LQFP-48(7×7 mm),便于手工与自动化贴装。品牌:NXP(恩智浦)。在选型与量产前,建议与供应链确认器件生命周期与可获得性,并获取完整规格书及评估板以开展验证。

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