WMSIC Electronic Components

TJA1055T/3/2Z TJA1055T

ModelTJA1055T/3/2Z
PackageSO-14
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP TJA1055T / 3 / 2Z
Type
NXP
Minimum package
2500 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
TJA1055T/3/2Z
Electronic Component
1
Package
SO-14
Type
CAN Transceiver
Electronic Component
CAN Transceiver
Electronic Component
0.42g
Electronic Component
1
Channel Count
1
Features
ESD; TXD;; Low Power; Bus
Electronic Component
BM0257222784
Operating Temperature
40℃~+125℃
Operating Voltage
4.75V~5.25V
Operating Current
21mA
Data
125Kbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TJA1055T/3/2Z 产品概述

一、产品简介

TJA1055T/3/2Z 是恩智浦(NXP)推出的一款用于 CAN 总线物理层连接的半收发器(half-transceiver),封装为 SO-14,适用于车用与工业级网络环境。该器件在 5V 工况下工作,专为稳定可靠的节点通信设计,可作为 CAN 控制器与差分总线之间的接口单元。

二、主要参数

  • 类型:CAN 收发器(半收发器)
  • 数据速率:125 kbps(系统典型配置)
  • 工作电压:4.75 V ~ 5.25 V
  • 工作电流:典型 21 mA(静态/工作态典型值,具体视工作条件而定)
  • 工作温度:-40 ℃ ~ +125 ℃(汽车/工业级温度范围)
  • 封装:SO-14(14 引脚)
  • 品牌:NXP(恩智浦)

三、主要特性与优势

  • 适合 5V 系统:工作电压范围针对常见车载与工业供电设计,易于与 5V 控制器配合。
  • 宽温度工作:-40℃ 至 +125℃ 的温度等级满足苛刻环境下的可靠性需求。
  • 低功耗表现:典型工作电流约 21 mA,有利于整车或系统功耗控制。
  • 封装与兼容性:SO-14 标准封装,便于现有板级布局替换与生产导入。
  • 总线接口稳定:用于差分 CAN_H/CAN_L 接口,适配常见 CAN 网络拓扑。

四、典型应用场景

  • 汽车车身与车载控制模块(BCM、ECU 子模块)
  • 工业控制与自动化现场总线节点
  • 建筑设备与楼宇自动化系统中的通讯接口
  • 船舶或轨道交通的控制与监测网络(需按系统规范验证)

五、设计与使用建议

  • 电源去耦:VCC 引脚应靠近器件放置 0.1 µF 陶瓷去耦电容,降低瞬态噪声。
  • 总线终端:在 CAN 总线两端使用 120 Ω 终端电阻,减少反射;分支线与 Stub 长度应最小化。
  • PCB 布局:差分线 CAN_H/CAN_L 保持配对、等长并远离高频开关噪声源;接地回路尽量短且牢靠。
  • ESD 与浪涌保护:虽然器件设计考虑总线工作环境,但建议在需高可靠性场合加外部 TVS 或瞬态抑制器以提高抗扰性。
  • 软件与故障处理:结合上层控制器实现总线故障检测、节点隔离与重试策略,保障系统鲁棒性。

六、封装与可靠性信息

TJA1055T/3/2Z 采用 SO-14 封装,适合自动化贴片装配。器件的工作温度和电流参数指向车规级与工业级应用,但在最终导入前应根据目标应用做完整的热、EMC 与车规验证。采购时建议关注恩智浦的可靠性认证与供货版本信息,以保证长期稳定供应与一致性。

(以上为基于给定基础参数的产品概述,具体电气特性、引脚定义与时序等请参阅 NXP 官方数据手册以获得详尽规范。)

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