WMSIC Electronic Components

MKE04Z128VLD4

ModelMKE04Z128VLD4
PackageLQFP-44(10x10)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP MKE04Z128VLD4
Type
NXP
Minimum package
800 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
MKE04Z128VLD4
Electronic Component
1
Package
LQFP-44(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.56g
CPU
32 Bit
CPU
ARM Cortex-M0+
I / O
38
RAM
16KB
Electronic Component
1
ADC
12bit
DAC
6bit
Features
(BOR / LVD / LVR / LVI);; positions(POR); Gate positions; Built-in General Purpose; CRC
Electronic Component
BM0265968507

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MKE04Z128VLD4 单片机产品概述

MKE04Z128VLD4是恩智浦(NXP)推出的Kinetis E系列32位单片机,以ARM Cortex-M0+内核为核心,针对中小型嵌入式系统的控制需求优化设计,兼具高性价比、宽环境适应性与紧凑封装特点,广泛适配工业控制、消费电子及物联网节点等场景。

一、核心性能与存储配置

这款单片机搭载ARM Cortex-M0+ 32位内核,最高主频可达48MHz,具备32位运算能力,相比8位/16位单片机在复杂控制逻辑、数据处理速度上有显著优势,同时保持Cortex-M0+系列的低功耗特性,适合电池供电或对功耗敏感的应用。

存储方面,内置128KB FLASH程序存储器与16KB SRAM数据存储器:128KB FLASH可满足多数中小型程序(如传感器数据采集、简单电机控制、通信协议栈)的存储需求,支持在线编程与擦除;16KB SRAM则为运行时变量、堆栈提供充足空间,保障程序流畅执行。

二、宽范围工作参数

MKE04Z128VLD4的工作参数适配恶劣与多样环境:

  • 工作电压:2.7V~5.5V宽电压范围,兼容3.3V、5V供电系统,无需额外电压转换电路,简化硬件设计;
  • 工作温度:-40℃~+105℃工业级温度范围,可稳定运行于高低温环境(如户外传感器节点、车间控制设备);
  • 振荡器:内置高速振荡器,无需外接晶振即可实现48MHz主频,减少BOM成本与PCB布局复杂度。

三、外设资源与封装

外设资源覆盖数字、模拟、通信三大类,满足基础控制需求:

  • 数字I/O:38个通用I/O引脚,支持推挽、开漏等多种驱动模式,可配置为输入/输出、中断触发等功能;
  • 模拟外设:12位16通道ADC(采样精度满足多数模拟信号采集,如温度、压力传感器),1通道6位DAC(可用于简单模拟信号输出,如音频、控制电压);
  • 通信接口:集成1个UART(支持异步通信)、1个SPI(高速串行外设)、1个I2C(多设备串行通信),可对接传感器、显示屏、无线模块等外设;
  • 定时器:3个通用定时器(GPT)、1个周期中断定时器(PIT),支持定时中断、PWM输出(用于电机调速、LED调光);
  • 封装:采用44脚LQFP封装(尺寸10mm×10mm,引脚间距0.8mm),体积紧凑,适合高密度PCB设计,同时便于自动化贴片生产。

四、典型应用场景

凭借宽温宽压、低功耗与紧凑封装,MKE04Z128VLD4可覆盖以下场景:

  1. 工业控制:小型电机控制器、传感器数据采集节点、车间环境监测设备(适配-40℃~+105℃工业环境);
  2. 消费电子:智能家居小模块(如智能插座、温湿度监测器)、手持设备控制核心(低功耗延长电池续航);
  3. 物联网节点:低功耗无线传感器节点(对接蓝牙、ZigBee模块,实现数据上传);
  4. 教育与原型开发:嵌入式开发板核心(资源丰富,适合初学者学习单片机编程)。

五、产品优势总结

  • 高性价比:Cortex-M0+内核平衡性能与成本,128KB存储容量满足多数中小型应用,无需额外扩展;
  • 环境适应性强:宽温宽压设计适配恶劣场景,内置振荡器简化硬件;
  • 紧凑易集成:44LQFP封装体积小,外设丰富无需外接额外芯片,降低系统复杂度;
  • 开发便捷:NXP提供完整的开发工具链(如MCUXpresso IDE)与参考设计,加速产品开发周期。

MKE04Z128VLD4作为Kinetis E系列的经典型号,是中小型嵌入式系统控制核心的可靠选择,兼顾性能、成本与实用性。

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