WMSIC Electronic Components

MC56F8025VLD

ModelMC56F8025VLD
Package44-LQFP(10x10)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP MC56F8025VLD
Type
NXP
Unit
Electronic Component
Minimum package
800 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
MC56F8025VLD
Electronic Component
1
Package
44-LQFP(10x10)
Electronic Component
Digital Signal Processor (DSP / DSC)
Electronic Component
19.867g
Electronic Component
1
FLASH
32KB
Electronic Component
BM0264547240
Operating Voltage
3V~3.6V
Electronic Component
32MHz
Electronic Component
Electronic Component
Electronic Component
800

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MC56F8025VLD 产品概述

一、产品简介

MC56F8025VLD 为 NXP(恩智浦)品牌的一款 16 位单片微控制器,封装为 44 引脚 LQFP(10×10 mm)。器件具有最高主频 32 MHz、内部 FLASH 容量 32 KB,工作电压范围 3.0 V 至 3.6 V。该芯片定位于对性能和成本有平衡要求的嵌入式控制应用,适用于对实时性和稳定性有一定需求的系统设计。

二、核心特性概述

  • 16 位处理核心,适合中等算力的运算与控制任务;在 32 MHz 主频下可提供确定性响应。
  • 32 KB FLASH 为主程序与部分数据存储提供容量,适合紧凑型固件和引导程序设计。
  • 3.0–3.6 V 的工作电压范围便于与常见的 3.3 V 电源系统集成,利于低功耗设计。

三、封装与硬件注意事项

44-LQFP(10×10 mm)封装提供足够的 I/O 引脚密度,便于外设连接与 PCB 布局。设计时应注意稳压与去耦:主电源近端放置 0.1 μF 和 1 μF 去耦电容,考虑上电顺序与纹波控制;对关键信号线做好地平面与走线屏蔽,保证信号完整性与 EMC 性能。

四、应用建议与适用场景

适合工业控制小型设备、传感器节点、消费类电子和嵌入式接口板等场景。若固件体积及运算需求较小,MC56F8025VLD 可作为低成本控制核心;若需要更多存储或更高实时算力,则建议选用更大 FLASH 或更高主频的系列产品。

五、开发与调试要点

开发前应获取完整数据手册与参考设计,确认引脚复用和外设功能。使用厂家或兼容的编译器、调试器进行固件开发,提前规划引导/升级策略与看门狗、掉电保护等机制,确保现场可靠性。

六、选型提示

当设计对成本、功耗与封装密度有明确限制且程序规模中等时,MC56F8025VLD 是合适选择。若需要更多外设、较大 FLASH 或更快的处理速度,应对比同系列或其他 NXP 产品,综合评估资源与生态支持后做最终决定。

总结:MC56F8025VLD 以其 16 位架构、32 KB FLASH 与 32 MHz 主频,在诸多嵌入式小型控制应用中提供了性能与成本的平衡,适合需要稳定、紧凑固件实现的项目。

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