Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MMPF0100F0AZES
Configuration
1 options
Configuration
21+
Available for RFQ
Technical data
Product details
15
specifications
Core information
- Product name
- NXP MMPF0100F0AZES
- Type
- NXP
- Minimum package
- 260 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- MMPF0100F0AZES
- Electronic Component
- 1
- Package
- QFN-56-EP(8x8)
- Electronic Component
- Specialized Power Management(PMIC)
- Electronic Component
- 0.147g
- Electronic Component
- 1
- Features
- Dynamic Voltage
- Electronic Component
- BM0265088235
- Electronic Component
- Electronic Component
- Electronic Component
- 260
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMPF0100F0AZES 产品概述
一、主要特点
- 专业电源管理单元（PMIC），型号 MMPF0100F0AZES，来自 NXP（恩智浦）。
- 封装：QFN-56-EP (8×8)，利于高密度板面布局与散热。
- 可调限流：外部可配置限流阈值，保护后端负载与电源轨。
- 上电时序控制：支持多路电源的编程上电/关断序列，满足SoC/FPGA等器件对电源时序的严格要求。
- 工作状态指示：提供状态输出信号，便于系统监控与故障诊断。
- 动态电压调节（DVS）：在运行时可调整输出电压以节能或性能调优。
- 可调软启动：软启动时间可配置，降低启动涌流，保护电源与电容。
- 过流保护：具备快速响应的过流检测与保护策略，提升系统可靠性。
二、功能与优势
MMPF0100F0AZES 将多路稳压、限流与时序控制集成于单芯片，适合对电源管理有集中控制需求的系统平台。动态电压调节功能可配合处理器节能策略，在高性能与低功耗之间灵活切换；可调软启动与可调限流降低启动与瞬态应力，延长器件寿命。工作状态输出便于与系统监控器（PMIC监控器或MCU）联动，实现故障报警与自动复位。
三、封装与热管理
QFN-56-EP (8×8) 封装提供底部散热焊盘，有利于热量通过PCB传导到大面积铜箔。建议在PCB下方设计充足的热过孔并连接到内层/底层散热平面，配合合理的走线与旁路电容布局，以保证长时间稳定工作与高效率运行。
四、典型应用
- 多核处理器、应用处理器与系统级芯片（SoC）的电源管理
- 工业控制与网络通信设备的多轨电源方案
- 高性能FPGA与ASIC供电系统
- 便携式设备与边缘计算终端的电源管理子系统
五、设计注意事项
- 输入/输出电容、旁路电容应接近芯片引脚，降低寄生阻抗与环路阻抗。
- 上电时序与软启动参数需根据负载特性与下游器件要求调整，避免出现电源冲突或重置问题。
- 设置限流与过流门限时，留有合适余量以避免正常工作瞬态触发误动作。
- 使用状态指示信号做系统级监控时，应考虑滤波与去抖处理，防止短脉冲误报。
- PCB 布局优先考虑散热与关键信号完整性，必要时做热仿真验证。
如需更详细的电气参数、引脚定义或参考设计，建议查阅 NXP 官方资料表与评估板文档。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
