WMSIC Electronic Components

LPC1778FBD208K

ModelLPC1778FBD208K
Package208-LQFP(28x28)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP LPC1778FBD208K
Type
NXP
Unit
Electronic Component
Minimum package
180 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
LPC1778FBD208K
Electronic Component
1
Package
208-LQFP(28x28)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
7.558g
CPU
32 Bit
CPU
ARM Cortex-M3
I / O
165
RAM
96KB
Electronic Component
1
ADC
12bit
DAC
10bit
EEPROM
4KB

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPC1778FBD208K 产品概述

一、主要特性

LPC1778FBD208K 是恩智浦(NXP)基于 ARM Cortex-M3 内核的高性能 32 位微控制器,最高主频 120 MHz。器件集成 512 KB Flash 程序存储、96 KB SRAM、4 KB EEPROM,内置振荡器,工作电压范围 2.4V~3.6V,工作温度覆盖工业级 -40℃ 至 +85℃。封装为 208 引脚 LQFP(28 mm × 28 mm),丰富的引脚资源可支持复杂应用。

二、计算与存储能力

ARM Cortex‑M3 内核适合实时控制与嵌入式应用,120 MHz 的主频在多数控制、信号处理与通信任务中提供充足性能。512 KB 的片内 Flash 可容纳中大型固件,96 KB SRAM 提供运行时数据与栈空间,4 KB EEPROM 可用于保存经常更新的配置或校准数据,适合需要非易失参数存储的场合。

三、模数、数模与 I/O 能力

器件提供 12-bit ADC 与 10-bit DAC(可用于模拟输入采集与模拟输出)。总 I/O 数量达 165,适合多路传感器、外设接口与总线扩展。丰富的 I/O 与外设使得该芯片可胜任数据采集、信号处理、驱动控制及通信桥接等任务。

四、典型外设与通信能力

虽然本概述以基础参数为主,LPC17xx 系列通常集成多路串口、SPI/SSP、I2C、PWM、定时器、RTC 及外部中断等外设,适合实现多协议网关、工业控制、音频/信号采集与存储卡接口等功能。内置振荡器便于快速上电运行,必要时可外接晶振提高时钟精度。

五、应用场景建议

  • 工业控制:电机驱动、运动控制、伺服与编码器接口。
  • 数据采集:多路传感器采样、数据记录与滤波处理。
  • 通信网关:协议转换、边缘设备与以太网/USB 外围集成(视外设支持)。
  • 嵌入式人机界面:中等复杂界面与触摸控制(结合外部图形处理器或 TFT 驱动)。

六、设计与选型要点

  • 电源设计:建议使用稳定 3.3V 供应,关键点布置去耦电容,注意上电复位与 LDO 选择。
  • 时钟与精度:内置振荡器便捷,但对时序或通信精度要求高的系统应使用外部晶振或高精度时钟源。
  • EMC 与保护:工业应用建议做好信号隔离、浪涌保护与滤波,重要 IO 加保护电路。
  • 引脚规划:208 引脚封装提供大量复用功能,设计时需仔细评估引脚复用关系以避免冲突。

七、开发与可靠性

芯片支持丰富的软件开发生态(厂商驱动库、示例工程与调试工具),适配常用 IDE 与调试器。工作温度为 -40℃~+85℃,满足工业级可靠性要求,封装大引脚数利于扩展外设与实现高密度功能。

总结:LPC1778FBD208K 以其 Cortex‑M3 性能、充足的存储与丰富 I/O,为需要实时控制、复杂通信与多通道数据处理的中高端嵌入式系统提供了稳定且灵活的硬件平台。

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