WMSIC Electronic Components

NCE NCE3035Q

ModelNCE3035Q
PackageDFN-8(3x3)
BrandNCE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NCE NCE3035Q
Type
NCE
Minimum package
5000 卷

Technical parameters

Electronic Component
NCE
Electronic Component
NCE3035Q
Electronic Component
1
Package
DFN-8(3x3)
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.108g
Electronic Component
1
Electronic Component
BM0227782042
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
35W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
30V
Capacitor(Ciss)
2.33nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCE3035Q 产品概述

一、产品简介

NCE3035Q 是新洁能(NCE)推出的一款高电流、低导通电阻的 N 沟道功率 MOSFET,适用于中低压电源与开关应用。器件额定漏源耐压 30V,连续漏极电流 35A,封装为小型 DFN-8 (3×3),单只供应,工作温度范围宽(-55℃ ~ +150℃),适合空间受限且要求高功率密度的场合。

二、主要电气参数

  • 漏源电压 Vdss:30V
  • 连续漏极电流 Id:35A
  • 导通电阻 RDS(on):11mΩ @ Vgs=4.5V
  • 阈值电压 Vgs(th):3V @ 250µA
  • 总栅极电荷 Qg:45nC @ 10V
  • 输入电容 Ciss:2.33nF,输出电容 Coss:460pF,反向传输电容 Crss:230pF
  • 功耗 Pd:35W(需结合散热设计评估实际允许电流)

三、封装与热管理

DFN-8 (3×3) 封装体积小、寄生电感低,有利于快速开关和低 EMI 设计。但封装限制了散热能力,实际能承受的连续电流受 PCB 散热(铺铜面积、过孔与底铜)影响很大。建议在器件底部和焊盘下方采用大量散热铜箔与通孔,引出热流到多层 PCB 内的散热层。

四、应用场景

适用于同步整流、电源开关、DC-DC 转换、负载开关、电机驱动前级以及车载或工业电源等 30V 级别的高电流场合。凭借低 RDS(on) 与较大 Id,适合要求低导通损耗的功率路径。

五、设计注意事项与建议

  • 栅极驱动:Qg=45nC,建议使用能提供足够电流的驱动器或驱动级(±10V 驱动),并配合合适的栅极电阻以控制开关速度与过冲。
  • 开关损耗:Ciss/Coss/Crss 值对开关损耗与反向恢复行为影响明显,设计时需评估开关频率与能量回收策略。
  • 布局:采用短且宽的漏极/源极走线,源极优先做 Kelvin 引出以降低测量误差;为减小热阻,器件下方及大电流回路尽量加厚铜箔与过孔。
  • 可靠性:阈值电压 3V 表明对低压门极敏感性一般,若需在 4.5V 驱动下获得标称 RDS(on),应保证驱动电平稳定。

六、采购与使用

品牌:NCE(新洁能);封装:DFN-8 (3×3);单只供应。选型时请结合实际工作温度、散热方案和开关频率评估器件在实际电路中的损耗与结温,以确保长期可靠运行。若需替代或并联使用,请验证共享散热与电流均流特性。

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