WMSIC Electronic Components

NCE NCE0208KA

ModelNCE0208KA
PackageTO-252
BrandNCE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NCE NCE0208KA
Type
NCE
Unit
Electronic Component
Minimum package
2500 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NCE
Electronic Component
NCE0208KA
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.516g
Electronic Component
1
Electronic Component
BM0227693512
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
55W
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCE0208KA 产品概述

一、产品简介

NCE0208KA 是 NCE(新洁能)推出的一款 200V 等级 N 沟道功率 MOSFET,采用 TO-252(DPAK)表面贴装封装。器件适用于中高压开关场合,工作温度范围宽(-55℃~+150℃),在 VGS=10V 驱动下表现出良好的导通与开关特性。

二、主要电气参数

  • 漏-源耐压 Vdss:200V
  • 连续漏极电流 Id:8A
  • 导通电阻 RDS(on):260mΩ @ VGS=10V
  • 阈值电压 VGS(th):1.7V
  • 总栅电荷 Qg:16nC @ VGS=10V
  • 输出电容 Coss:90pF;输入电容 Ciss:540pF;反向传输电容 Crss:35pF
  • 耗散功率 Pd:55W(参考值,具体热性能依 PCB 散热而异)
  • 器件类型:N 沟道 MOSFET,封装:TO-252(DPAK),数量:1 个/器件

三、器件特性与优势

NCE0208KA 在 200V 电压等级中属于中等导通电阻器件,RDS(on) 在 10V 驱动下为 260mΩ,适合开关与功率传输兼顾的应用;较低的 Coss(90pF)有利于减少高压开关时的能量损耗;Qg=16nC 表明器件对驱动电流需求适中,便于采用常规门极驱动器驱动。宽温度范围增强了在严苛环境下的可靠性。

四、典型应用

  • 开关电源(SMPS)高压侧开关或同步整流(视电路拓扑)
  • 电机驱动与电子整流器的中高压开关元件
  • LED 驱动、功率适配器、继电器替代器等功率控制场景
  • 需要 200V 耐压且对体积与封装成本有要求的消费与工业设备

五、驱动与电路设计注意事项

  • 推荐栅极驱动电压 10V 以达到标称 RDS(on);驱动瞬态应考虑 Qg=16nC,选择合适驱动器和栅极电阻以平衡开关速度与振铃。
  • Crss(35pF)会引起米勒效应,快速开关时需做好栅极抑制与缓冲,避免误触发。
  • 高压开关场合建议并联吸收电路或 RC、TVS 等抑制尖峰,防止过压导致击穿或单脉冲应力。
  • PCB 布局需把功率回路最短、减少寄生电感,功率焊盘加大铜箔并配合过孔导热提高散热效率。

六、封装与热管理

TO-252(DPAK)为表面贴装功率封装,便于自动贴片与焊接。器件标称耗散功率 Pd=55W,但实际可用耗散受 PCB 散热、焊盘面积、空气流动和环境温度影响,设计时需按热阻和结-环境温升进行热仿真与裕量设计,必要时增加散热铜箔和多层过孔。

七、选型与可靠性建议

在选型时注意器件在工作点的 RDS(on) 随结温升上升而增加,应进行电流与温度的热裕量核算;若电路含大电流脉冲或有能量回灌,应评估器件的脉冲浪涌能力与单脉冲 SOA(厂家数据表确认)。存储和制造过程中应做好静电防护(ESD),并遵循厂家焊接温度曲线与回流规范。

结语:NCE0208KA 以其 200V 耐压、适中的导通电阻和适配 TO-252 的封装,在中高压开关与功率控制应用中为一种性价比较高的选择。设计时结合门极驱动、热管理与过压保护可获得稳定可靠的系统性能。

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