WMSIC Electronic Components

NCE NCE0110AS

ModelNCE0110AS
PackageSOP-8
BrandNCE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NCE NCE0110AS
Type
NCE
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NCE
Electronic Component
NCE0110AS
Electronic Component
1
Package
SOP-8
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.175g
Electronic Component
1
Electronic Component
BM0227596718
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
3.1W
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCE0110AS — 100V 10A N沟道 MOSFET 产品概述

一、产品简介

NCE0110AS 是新洁能(NCE)推出的一款高压 N 沟道功率 MOSFET,额定漏源电压 100V,连续漏极电流 10A,面向中小功率开关与线性应用场景。器件采用 SOP-8 封装,兼顾体积和成本,适合 PCB 型布线的散热与组装方式。

二、主要参数

  • 类型:N沟道 MOSFET(单个)
  • 漏源电压 Vdss:100 V
  • 连续漏极电流 Id:10 A
  • 导通电阻 RDS(on):20 mΩ @ Vgs=4.5V, Id=10A
  • 耗散功率 Pd:3.1 W(封装热限制相关)
  • 阈值电压 Vgs(th):1.8 V @ ID=250 μA
  • 输入电容 Ciss:4.2 nF
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOP-8
  • 品牌:NCE(新洁能)

三、关键特性与优势

  1. 100V 的耐压等级使其适用于较高电压侧的开关场合,如中间总线、逆变与功率变换器。
  2. 20mΩ 的低 RDS(on)(在 4.5V 驱动下)在中等电流条件下能有效降低导通损耗,提高效率。
  3. 输入电容 4.2nF 表明开关转换时栅极电荷适中,便于在常见驱动器和 MCU 直接或经驱动器控制下工作。
  4. SOP-8 封装兼顾了成本与装配便利性,适合通用消费类和工业级电路板设计。

四、热性能与可靠性

  • 器件的耗散功率 Pd=3.1W 是在特定散热条件下的封装极限值,实际应用中需根据 PCB 铜厚、散热面积、环境温度计算结到环境温升,并留有裕量。
  • 推荐在功率较大的场合增加散热铜箔、热孔或搭配散热片/铜底座,以避免长期高温下性能退化。
  • 工作温度范围宽(-55~+150℃),适应工业级环境,但应避免长期在高结温下运行以延长寿命。

五、典型应用场景

  • 开关电源(DC-DC 转换器)与同步整流
  • 电机驱动与电子负载开关
  • LED 驱动、恒流源和功率控制模块
  • 电池管理系统、逆变器及中小功率变换器

六、封装与使用注意事项

  • SOP-8 封装组装方便,但散热能力受限,封装本身热阻较大,PCB 设计时应加大散热铜箔并使用热孔过孔。
  • 栅极阈值 1.8V 表示可在较低电压下导通,但为了获得标称 RDS(on),建议驱动电压至少达到 4.5V,若需要更小导通阻抗可考虑 10~12V 驱动(注意封装和器件极限)。
  • 输入电容 4.2nF 表明在快速开关时栅极驱动电流不可忽视,应匹配合适驱动器以降低开关损耗与振荡风险。
  • 注意 ESD 防护与焊接热规范,避免超过规格表中的允许范围。

七、设计建议

  • 在高频切换应用中,关注开关损耗(与 Ciss 相关)与器件的温升,必要时并联器件或选择更大封装以分散热负荷。
  • 对于板级热管理,可在 MOSFET 下方和周边增加铜面积、设置过孔连接多层散热层,并进行热仿真验证。
  • 在驱动上,若由 MCU 直接驱动,确保输出电平和驱动能力能迅速为栅极充放电,避免慢速开关带来的高耗散。

总结:NCE0110AS 以 100V 耐压、10A 电流和 20mΩ@4.5V 的导通电阻,提供了在中小功率电源与开关场景中平衡成本、效率与体积的解决方案。设计时需重视封装散热与驱动匹配,以发挥器件最佳性能。

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