WMSIC Electronic Components

NCE NCE07TD60BF

ModelNCE07TD60BF
PackageTO-220F
BrandNCE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 141656

Availability on request

Technical data

Product details

20 specifications

Core information

Product name
NCE NCE07TD60BF
Type
NCE
Unit
Electronic Component
Minimum package
1000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NCE
Electronic Component
NCE07TD60BF
Electronic Component
1
Package
TO-220F
Electronic Component
IGBT / Module
Electronic Component
2.828g
Electronic Component
1
IGBTType
FS
Electronic Component
BM0265452479
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
32W
(Eon)
210uJ
(Eoff)
100uJ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCE07TD60BF 场截止型IGBT产品概述

NCE07TD60BF是新洁能(NCE)推出的一款场截止型(FS)IGBT,专为中小功率中压应用场景优化,具备600V耐压、7A连续集电极电流能力,采用TO-220F通孔封装,兼顾可靠性与设计便捷性,可满足多类工业与消费电子场景的开关需求。

一、产品基本信息

  • 品牌与型号:新洁能(NCE)NCE07TD60BF
  • IGBT类型:场截止型(FS),通过优化漂移区结构平衡导通损耗与开关损耗
  • 封装形式:TO-220F(通孔插件封装),支持散热片安装以提升功率密度
  • 工作温度范围:-55℃至+150℃,覆盖工业级高低温环境要求

二、核心电性能参数解析

该器件的关键参数适配中小功率中压应用,核心特性及意义如下:

  1. 耐压与电流能力:集射极击穿电压(Vces)600V,连续集电极电流(Ic)7A,正向脉冲电流(Ifm)21A(峰值耐受能力),满足220V/380V电源系统的电压裕量;
  2. 栅极特性:栅极阈值电压(Vge(th))4V(@1mA),栅极电荷量(Qg)28nC(@15V),输入电容(Cies)675pF——适中的栅极参数降低驱动电路复杂度,无需过高驱动功率;
  3. 损耗特性:导通饱和电压(VCE(sat))1.9V(@5A、15V),导通损耗(Eon)210μJ、关断损耗(Eoff)100μJ,反向恢复时间(Trr)230ns——FS结构实现导通与开关损耗的平衡,适合高频开关场景;
  4. 电容特性:输出电容(Coes)22pF、反向传输电容(Cres)13pF,低寄生电容有助于抑制EMI干扰。

三、封装与散热优势

TO-220F封装是成熟的通孔封装形式,具备以下特点:

  • 安装便捷:引脚布局符合标准通孔焊接要求,支持波峰焊或手工焊接,适配常规PCB设计;
  • 散热能力:封装自带散热片安装孔,可搭配小型铝制散热器,满足最大耗散功率(Pd=32W)的散热需求,避免结温过高;
  • 可靠性:封装材料耐高温、耐潮湿,结合宽温工作范围,适合户外或恶劣环境下的应用。

四、典型应用场景

NCE07TD60BF的参数特性使其适配多类中小功率中压应用:

  1. 开关电源:AC-DC电源适配器(如笔记本电脑、显示器电源)、DC-DC转换器(中等功率等级);
  2. 电机驱动:小功率无刷直流电机(BLDC)驱动、单相交流电机调速(如小型风扇、水泵);
  3. 逆变器:小型太阳能并网/离网逆变器(≤1kW)、家用储能逆变器;
  4. LED驱动:大功率LED照明的恒流驱动电路(中等功率等级)。

五、设计注意事项

为充分发挥器件性能,设计时需关注以下要点:

  1. 栅极驱动:驱动电压需高于阈值电压4V,推荐采用15V(与参数测试条件一致),驱动电阻需平衡开关速度与EMI(通常10Ω~100Ω);
  2. 散热设计:需根据实际功耗计算散热器面积,确保结温不超过150℃(最大工作温度);
  3. 续流二极管:若应用中需续流,建议搭配与Trr(230ns)匹配的快恢复二极管,避免反向恢复损耗过大;
  4. EMI抑制:低寄生电容(Cres=13pF)虽有助于抑制EMI,但仍需在PCB布局中考虑滤波电容、屏蔽等措施。

综上,NCE07TD60BF是一款性价比高的FS型IGBT,兼顾耐压、电流、损耗与封装便捷性,适合中小功率中压开关应用的快速设计与量产。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.