WMSIC Electronic Components

NUVOTON NAU82011WG

ModelNAU82011WG
PackageMSOP-8
BrandNUVOTON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
NUVOTON NAU82011WG
Type
NUVOTON
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NUVOTON
Electronic Component
NAU82011WG
Electronic Component
1
Package
MSOP-8
Electronic Component
Audio Power Amplifier
Electronic Component
0.124g
Electronic Component
1
Electronic Component
BM0257646828
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5.5V
Output Power
2.9Wx1@4Ω
Speaker Channel Count
Electronic Component
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NAU82011WG 产品概述

一、简介

NAU82011WG 是新唐(NUVOTON)面向小型音频输出设计的一款单声道 D 类功率放大器器件,采用 MSOP-8 小封装,工作电压范围宽(2.5V~5.5V),工作温度覆盖工业级(-40℃~+85℃),在 4Ω 负载下可提供典型 2.9W 的输出功率。凭借 D 类高效率的工作方式及小尺寸封装,适合便携或空间受限的音频终端应用。

二、主要特性

  • 单声道(1 通道)D 类功放,适用于单端扬声器驱动;
  • 典型输出功率:2.9W × 1(@4Ω,典型条件);
  • 宽工作电压:2.5V ~ 5.5V,支持常见锂电池和单节/多节供电方案;
  • 工作温度:-40℃ ~ +85℃,满足工业/消费类环境;
  • 封装形式:MSOP-8(小体积,便于 PCB 芯片级布局);
  • 具有 D 类放大器普遍优势:高效率、低功耗(有利于电池供电设备)和较小发热。

(注:器件可能集成过流、过温、欠压保护等常见保护功能,具体以产品数据手册为准。)

三、典型应用场景

  • 便携式蓝牙音箱、迷你音响、便携媒体播放器;
  • 平板/掌上游戏机、便携式多媒体终端的扬声器驱动;
  • 智能家居小型音频提示器或语音播报设备;
  • 其他空间受限且对功耗和散热有要求的音频放大场景。

四、系统集成要点

  • 电源:采用 2.5V~5.5V 的稳定单电源供电,建议在靠近 VDD 引脚处并联一颗 0.1µF 陶瓷旁路电容与一颗 4.7µF~10µF 低 ESR 电解/固态电容用于抑制瞬态和稳定供电;
  • 输入:若系统为直流耦合,建议在输入端加入合适的耦合电容以阻断直流分量;输入阻抗与音源匹配可通过外部电阻设定;
  • 输出:D 类输出对滤波和 EMI 敏感,若直接驱动近距离扬声器可采用无源滤波结构或直接输出(依器件是否为“filterless”设计而定);长线缆驱动场合建议在输出端增加小电感或 LC 低通滤波器并使用屏蔽线缆以降低 EMI。

五、封装与环境适应

MSOP-8 封装体积小、占板面积低,适合便携和空间受限设计。器件工作温度范围覆盖工业级,适合室外或温度变化较大的应用场景。MSOP-8 封装的散热能力有限,设计时需关注 PCB 热散布。

六、PCB 布局与散热建议

  • 电源和地线应尽量宽且短,电源旁路电容靠近 VDD 和 GND 引脚布置;
  • 输出回路走线尽量短且分离模拟信号线与功率线,避免高频环路与敏感信号平行布线;
  • 若条件允许,在器件下方或周边布置散热铜箔,保持良好地平面以便热量扩散;
  • 输出端的布线加上合适的 EMI 抑制元件(如铁氧体 beads、滤波电感)可以减小电磁干扰对周围电路的影响。

七、使用注意事项与推荐外部元件

  • 电源去耦:0.1µF 陶瓷 + 4.7µF~10µF 低 ESR 电容;
  • 输入耦合:根据音源直流偏置选择 0.1µF~4.7µF 电解或陶瓷耦合电容;
  • 输出滤波/抑噪:如需,则选用适合频率带宽的 LC 滤波器或铁氧体 bead;
  • 保护:请参考数据手册确认器件是否内置过流/过温保护,必要时在系统层面增加保险或限流措施;
  • 调试:在不同供电电压与负载条件下验证器件稳定性、失真与热特性,确保在最大工作功率下仍满足热设计要求。

结语:NAU82011WG 为小功率单声道 D 类放大器,适合追求高效率、占板面积小的便携音频设备。具体管脚功能、保护特性、失真与效率曲线及推荐典型应用电路,请参照新唐官方数据手册与评估板资料。

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