WMSIC Electronic Components

NUVOTON N76E885AT28

ModelN76E885AT28
PackageTSSOP-28
BrandNUVOTON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NUVOTON N76E885AT28
Type
NUVOTON
Unit
Electronic Component
Minimum package
4000 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NUVOTON
Electronic Component
N76E885AT28
Electronic Component
1
Package
TSSOP-28
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.28g
CPU
8 Bit
CPU
51
I / O
25
RAM
512Byte
Electronic Component
1
EEPROM
4KB
Electronic Component
BM0259012168
Operating Temperature
40℃~+105℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

N76E885AT28 产品概述

一、产品简介

N76E885AT28 是新唐(NUVOTON)基于 51 指令集的 8 位单片机,封装为 TSSOP-28,面向中小型嵌入式控制与工业应用。器件集成了 18KB Flash 程序存储、4KB EEPROM 数据存储及丰富的 I/O 资源,兼顾成本、可靠性与开发友好性,适合替代传统 8051 系列在低功耗与工业级温度场景下的应用。

二、主要规格

  • CPU 核心:51 家族兼容,8 位架构
  • 最高主频:25 MHz
  • 程序存储:18 KB Flash
  • SRAM(内部 RAM):512 Byte
  • EEPROM:4 KB(用于持久化数据)
  • I/O 数量:25 路通用 I/O
  • 振荡器:内置振荡器(减少外部元件依赖)
  • 工作电压:2.4 V ~ 5.5 V
  • 工作温度:-40 ℃ ~ +105 ℃
  • 封装形式:TSSOP-28(28 引脚)

三、核心特性与优势

  • 兼容 51 指令集:现有 8051 软件与工具链(如 Keil 等)可快速移植与开发,降低入门门槛。
  • 程序/数据分区明确:18KB Flash 用于应用固件,4KB EEPROM 提供可靠的数据保存空间,适合需要参数记忆或少量日志的场景。
  • 宽工作电压与工业温度:2.4–5.5V 电压范围与 -40~+105℃ 温度等级,适合汽车电子、仪器仪表与工业控制等严苛环境。
  • 集成内振荡器:减少外部晶振与旁路元件,缩小 BOM 并简化 PCB 布局。
  • 足够的 I/O 与外设扩展能力:25 路 GPIO 可满足多数传感器、按键、指示灯及外设接口需求;并可通过外设接口扩展更多功能(具体外设能力请参阅数据手册)。

四、典型应用场景

  • 工业控制与自动化终端(传感器节点、控制器)
  • 家电与智能家居控制板(按键、显示、驱动)
  • 仪器仪表与采集模块(参数存储与简单处理)
  • 便携式电子设备与电池供电产品(低功耗设计可行)

五、选型与设计建议

  • 电源与去耦:在 2.4–5.5V 范围内使用稳定电源,并在 VCC 附近放置足够的去耦电容以抑制瞬态噪声。
  • 时钟策略:内置振荡器便于快速开发,但对高精度时序需求(如精确通信或 ADC)建议采用外部晶振或校准方案。
  • EEPROM 使用:4KB EEPROM 适合参数保存,注意写次数与擦写周期管理,必要时采用磨损均衡策略。
  • 编程与调试:依托 51 系生态,推荐使用成熟的开发工具链与仿真器,注意查看新唐官方数据手册与参考设计以获取引脚复用与电气限制信息。
  • 热管理与布局:在高温环境或大电流外设驱动场景下,优化 PCB 布局以降低热集中,确保长期可靠性。

如需进一步的引脚分配、外设功能、典型电路或参考设计,请根据项目需求提供更具体的应用场景或直接查询 Nuvoton 官方数据手册与应用笔记。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.