Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ERJ3EKF4021V
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERJ3EKF4021V
- Type
- PANASONIC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERJ3EKF4021V
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 4.02kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264224053
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERJ3EKF4021V 产品概述
概要
ERJ3EKF4021V 是由日本知名品牌松下（PANASONIC）生产的一款高性能贴片电阻，属于0603 封装尺寸。以下是对此产品的详细介绍，包括其关键参数、应用场景和优点。
基础参数
- 功率: 100 mW
- 商品分类: 贴片电阻
- 工作温度范围: -55℃ ~ +155℃
- 最大工作电压: 150 V
- 温度系数: ±100 ppm/℃
- 电阻类型: 厚膜电阻
- 精度: ±1%
- 阻值: 4.02 kΩ
封装和尺寸
ERJ3EKF4021V 采用 0603 封装，这是一种常见的贴片电阻封装形式，尺寸为 1.6 mm x 0.8 mm x 0.45 mm。这种小尺寸设计使其非常适合用于现代电子设备中的高密度布局。
工作特性
- 工作温度范围：-55℃ ~ +155℃，这意味着该电阻可以在极端温度条件下稳定工作，适用于各种环境下的应用。
- 最大工作电压：150 V，确保了在高压环境下也能保持稳定性能。
- 温度系数：±100 ppm/℃，这是一个非常低的温度系数，表明该电阻对温度变化的敏感度很低，能够提供高度稳定的电阻值。
电阻类型
ERJ3EKF4021V属于厚膜电阻。厚膜电阻因其良好的稳定性、耐用性和成本效益而广泛应用于各种电子设备中。它们通过在陶瓷基板上沉积厚膜材料来制造，具有良好的抗震性和抗腐蚀性。
精度和阻值
- 精度：±1%，这是一个较高的精度水平，适用于需要精确控制电阻值的应用场景。
- 阻值：4.02 kΩ，这是一个常见且有用的阻值，广泛应用于信号处理、电源管理、滤波器等多种电路中。
应用场景
ERJ3EKF4021V 因其优异的性能和小尺寸设计，适用于以下多种应用场景：
- 消费电子产品：如智能手机、平板电脑、穿戴设备等。
- 工业控制系统：如PLC、传感器系统等。
- 汽车电子设备：如车载音响系统、导航系统等。
- 医疗设备：如心率监测器、血压计等。
- 通信设备：如基站设备、无线路由器等。
品牌优势
松下（PANASONIC）是一家全球知名的电子元器件制造商，拥有数十年的研发和生产经验。其产品以高质量、可靠性和创新性而闻名。选择松下的ERJ3EKF4021V，可以确保您获得高性能、稳定可靠的贴片电阻。
总结
ERJ3EKF4021V 是一款高性能、多功能的贴片电阻，通过其优异的参数和小尺寸设计，能够满足现代电子设备对高密度布局和稳定性能的需求。其广泛的应用场景以及来自知名品牌松下的保证，使其成为许多工程师和设计师的首选产品。无论是在消费电子、工业控制还是医疗设备领域，ERJ3EKF4021V 都是一个值得信赖的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
