WMSIC Electronic Components

ERJ2RKF7502X

ModelERJ2RKF7502X
Package0402
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PANASONIC ERJ2RKF7502X
Type
PANASONIC
Minimum package
10000

Technical parameters

Power
100mW
Electronic Component
PANASONIC
Electronic Component
ERJ2RKF7502X
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
75kΩ
Electronic Component
1
Electronic Component
BM0257349549
Operating Temperature
55℃~+155℃
Electronic Component
±100ppm/℃
Resistor Type
Resistor
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ2RKF7502X 厚膜贴片电阻产品概述

一、核心规格参数

ERJ2RKF7502X是松下针对中小功率电路设计的厚膜贴片电阻,核心参数与应用场景精准匹配:

  • 阻值与精度:固定阻值75kΩ,精度±1%,满足一般工业、消费电子对阻值一致性的需求;
  • 功率等级:额定功率100mW(0402封装常规功率段),适合小信号调理、限流等低功耗场景;
  • 温度特性:温度系数±100ppm/℃,即温度每变化1℃,阻值漂移≤75Ω(75kΩ×100ppm),在-55℃~+155℃宽温范围内性能稳定;
  • 工作环境:存储温度-55℃~+125℃,符合汽车电子、工业控制的高低温可靠性要求。

二、封装与物理特性

采用0402封装(英制编号,对应公制1005,即长1.0mm×宽0.5mm),是当前小型化电子设备的主流封装之一,具体物理参数如下:

特性 数值 备注 封装尺寸 1.00±0.15mm(长)×0.50±0.15mm(宽)×0.35±0.10mm(厚) 符合JIS C 5102标准 电极结构 银钯合金电极(端电极)+ 镍阻挡层 + 锡镀层 提升焊接可靠性与抗硫化性能 基板材料 96%氧化铝陶瓷 耐高温、低膨胀,匹配电阻膜稳定性 保护层 硼硅玻璃釉 防潮、防腐蚀,隔离外部环境干扰

三、性能优势

  1. 成本与性能平衡:厚膜工艺(丝网印刷电阻浆料+烧结)比薄膜电阻成本低30%~50%,同时实现±1%精度与100ppm/℃温度系数,适合批量应用;
  2. 宽温稳定性:-55℃+155℃工作范围覆盖汽车(-40℃+85℃)、工业(-20℃~+105℃)等场景,长期高温下阻值变化≤±1%(1000小时负载测试);
  3. 小体积高密度:0402封装仅为0603封装体积的1/4,可提升PCB布线密度,适配智能手机、可穿戴设备等小型化产品;
  4. 抗环境干扰:玻璃釉保护层通过湿热测试(40℃/90%RH 1000小时),阻值漂移≤±0.5%;抗振动性能满足10~2000Hz、20m/s²振动10小时,阻值变化≤±1%。

四、典型应用场景

ERJ2RKF7502X的参数特性使其广泛覆盖以下领域:

  1. 消费电子:智能手机电源管理(电池分压检测、充电限流)、平板电脑音频滤波电路;
  2. 工业控制:PLC模块信号调理(传感器输出分压、运放偏置)、小型变频器辅助电路;
  3. 汽车电子:车载信息娱乐系统(中控屏按键电路、蓝牙模块匹配)、车身控制模块(BCM)辅助信号电路;
  4. 可穿戴设备:智能手表心率传感器接口、手环低功耗时钟电路;
  5. 通信设备:小型基站射频匹配、路由器电源滤波。

五、使用注意事项

  1. 功率降额:0402封装100mW为额定功率,实际应用建议降额至70%以下(≤70mW),避免过热导致阻值漂移;
  2. 焊接工艺:推荐回流焊(温度曲线符合J-STD-020,峰值温度245℃±5℃,时间≤10秒);手工焊温度≤350℃,焊接时间≤3秒;
  3. 静电防护:虽厚膜电阻抗静电能力强于薄膜,但建议采用HBM≤2kV、MM≤200V的ESD防护措施;
  4. 存储条件:未开封产品存储于25℃±5℃、湿度40%~60%环境,开封后建议12个月内使用完毕。

六、选型替代参考

若需调整参数,可参考以下替代方案:

  • 更高精度需求:选松下ERJ-2RKF7502X(薄膜电阻,±0.1%精度,成本提升);
  • 更大功率需求:选0603封装的ERJ3RKF7502X(200mW功率);
  • 更低温度系数:选ERJ-2RKF7502X(±50ppm/℃,薄膜工艺)。

ERJ2RKF7502X作为松下厚膜电阻系列的经典型号,凭借高性价比、宽温稳定与小体积优势,成为中小功率电路的主流选择,适用于从消费电子到工业控制的多场景批量应用。

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