Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ERJ3EKF6802V
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERJ3EKF6802V
- Type
- PANASONIC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERJ3EKF6802V
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 68kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264567829
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERJ3EKF6802V 厚膜贴片电阻产品概述
一、产品基本属性与核心规格
ERJ3EKF6802V是松下（PANASONIC）推出的厚膜贴片电阻，针对中精度、低功耗场景设计，核心参数明确如下：
- 封装尺寸：0603（英制标识，对应公制1608，尺寸1.6mm×0.8mm），适配小型化SMT贴装；
- 阻值与精度：标称阻值68kΩ（E96系列标识“6802”，符合常规电阻编码规则），精度±1%，满足多数电路对阻值准确性的需求；
- 功率特性：额定功率100mW，为0603封装厚膜电阻的典型功率等级，适配低功耗电路；
- 温度特性：温度系数（TCR）±100ppm/℃，阻值随温度变化的漂移可控；
- 工作温区：-55℃~+155℃，覆盖工业、消费电子等多场景的高低温环境。
二、厚膜工艺与材料优势
该产品采用厚膜丝网印刷烧结工艺，核心材料与工艺特点：
- 基片：以氧化铝陶瓷为载体，绝缘性好、热稳定性高，避免高温下基片变形导致阻值漂移；
- 电阻层：使用钌系厚膜电阻浆料，经高温烧结形成致密电阻膜，阻值一致性优于普通碳膜电阻；
- 终端电极：采用多层金属电极（镍/锡镀层），焊接兼容性强，抗硫化性能优于单一镀层电极，适合户外或工业环境。
三、关键性能与场景适配性
1. 宽温区可靠性
-55℃~+155℃的工作范围，可覆盖工业控制（如PLC模块）、车载辅助电路（如仪表盘传感器）、户外小型设备等场景；结合±100ppm/℃的TCR，155℃下阻值最大漂移约1.3%（130℃温差×100ppm），满足常规精度需求。
2. 精度与一致性
±1%的精度等级，适用于信号分压、电源反馈、传感器调理等需要准确阻值的电路；松下厚膜工艺的批量一致性控制较好，同批次产品阻值偏差分布窄，减少电路调试工作量。
3. 功率与封装平衡
0603封装搭配100mW功率，既满足便携式电子（手机、智能手表）、小型家电（机顶盒、路由器） 等紧凑设计需求，又避免功率冗余导致的成本上升。
四、选型与使用注意事项
- 功率降额：实际使用功率建议不超过额定功率的80%（即80mW），避免长期过热导致阻值老化；
- 焊接工艺：SMT贴装时需匹配0603封装的回流焊参数（建议峰值温度230250℃，时间1030s），避免焊接温度过高损伤电阻膜；
- 存储条件：建议存储在湿度<60%的干燥环境，避免长期暴露在潮湿中影响电极焊接性；
- 特殊场景筛选：若应用于医疗设备等超高精度场景，需进一步筛选TCR更小的型号，该产品仅满足常规中精度需求。
五、总结
ERJ3EKF6802V是松下厚膜电阻系列中性价比突出的型号，平衡了精度、功率、成本与环境适应性，适用于多数中精度、低功耗、宽温区的贴片电路场景，是工业控制、消费电子、便携式设备等领域的常规选型之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
