WMSIC Electronic Components

ERJ6ENF9102V

ModelERJ6ENF9102V
Package0805
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ6ENF9102V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ6ENF9102V
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.031g
Electronic Component
91kΩ
Electronic Component
1
Electronic Component
BM0264850108
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ6ENF9102V 贴片厚膜电阻产品概述

ERJ6ENF9102V是松下(PANASONIC)推出的一款0805封装厚膜贴片电阻,针对小信号电路的稳定阻值需求设计,核心参数匹配91kΩ阻值、±1%精度及125mW额定功率,广泛适用于工业控制、汽车电子及消费电子等领域。

一、产品核心身份与定位

该型号属于松下厚膜电阻系列中的基础款,采用陶瓷基片厚膜工艺制造,兼顾成本与可靠性,主要面向对阻值精度、宽温稳定性有要求的小功率电路。型号命名逻辑清晰:

  • “ERJ6”代表松下厚膜贴片电阻系列;
  • “ENF”对应封装及功率等级(0805封装,125mW);
  • “9102”为阻值代码(实际阻值91kΩ);
  • “V”标识环保版本(符合RoHS标准,不含铅、镉等有害物质)。

二、关键电气性能参数解析

ERJ6ENF9102V的电气参数精准匹配通用电路需求,核心指标可支撑多数模拟信号处理场景:

1. 阻值与精度

  • 标称阻值:91kΩ(91000Ω),属于中高阻范围,常见于分压、信号衰减、反馈环路等设计;
  • 精度等级:±1%,即实际阻值偏差在89.99kΩ~92.01kΩ之间,无需额外校准即可满足工业级电路对阻值一致性的要求。

2. 功率与电压限制

  • 额定功率:125mW(0.125W),为25℃环境下的最大持续功耗,实际应用需遵循降额原则(如高温环境下需降低功率使用);
  • 最大工作电压:200V,需注意:当电压达到200V时,功耗约为439mW(远超额定功率),因此实际持续工作电压建议不超过107V(√(125mW×91kΩ))。

3. 温度系数与稳定性

  • 温度系数(TCR):±100ppm/℃,表示温度每变化1℃,阻值变化±0.01%;
  • 宽温稳定性:在-55℃~+155℃范围内,阻值最大变化约±1.3%(155℃与25℃温差130℃),可稳定适配汽车发动机舱、工业高温车间等极端环境。

三、物理封装与工艺特性

1. 封装尺寸

采用0805英制封装,对应公制尺寸为2.0mm(长)×1.2mm(宽)×0.5mm(厚),适配主流贴片设备的贴装精度,可兼容多数PCB设计的布局需求(建议焊盘尺寸1.0mm×1.4mm)。

2. 厚膜工艺优势

该电阻采用陶瓷基片厚膜印刷烧结工艺,相比薄膜电阻有明显优势:

  • 电阻膜层厚度约10~100μm,抗磨损、抗静电能力更强;
  • 膜层与基片结合牢固,长期使用无阻值漂移风险;
  • 生产一致性好,批量产品阻值偏差可稳定控制在±1%以内,降低电路调试难度。

四、环境适应性与可靠性

ERJ6ENF9102V针对工业及汽车级应用优化了环境耐受性:

  • 温度范围:-55℃~+155℃,覆盖全球多数地区的极端温度场景;
  • 湿度耐受性:可在95%RH(40℃)环境下长期工作,满足潮湿地区或密闭电子设备的需求;
  • 抗浪涌能力:符合IEC 61000-4-5标准,可承受1kV(1.2/50μs)浪涌电压,避免电路瞬间过压损坏;
  • 可靠性认证:通过松下内部高温存储、温度循环等测试,失效率低,适合长期运行的设备。

五、典型应用场景

结合参数特性,该电阻主要应用于以下领域:

  1. 汽车电子:车载传感器(温度、压力)分压电路、仪表盘模拟信号调理、车身控制模块(BCM)滤波;
  2. 工业自动化:PLC模拟输入模块、传感器接口电路、电机驱动电流采样反馈;
  3. 消费电子:DC-DC转换器反馈环路、音频信号衰减、LED驱动限流;
  4. 通信设备:路由器/交换机电源滤波、低频信号接口阻抗匹配。

六、选型与使用注意事项

  1. 降额使用:高温环境(>100℃)下,需将功率降至额定值的50%以下,避免阻值漂移;
  2. 电压优先:实际工作电压需同时满足“功率≤125mW”和“电压≤200V”,优先以功率限制为准;
  3. 焊接要求:采用回流焊工艺时,需控制峰值温度≤260℃(持续时间≤10s),避免损坏电阻膜层;
  4. 环保合规:该型号为RoHS compliant,可满足欧盟及国内环保法规要求。

ERJ6ENF9102V凭借稳定的性能、宽温适应性及松下的品牌可靠性,成为小功率模拟电路中91kΩ阻值的高性价比选型,可覆盖多数工业及消费电子领域的设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.