Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERJ6ENF2201V是松下(PANASONIC)推出的一款0805封装贴片厚膜电阻,针对电子设备基础电路设计优化,兼具体积紧凑、性能稳定、成本适中的特点,广泛适用于消费电子、汽车电子、工业控制等领域。
该电阻属于松下厚膜电阻系列的常规功率型产品,型号命名遵循行业标准:
产品采用表面贴装设计,无需插件孔,可直接通过SMT工艺焊接于PCB,适配自动化生产流程。
标称阻值为2.2kΩ(2200Ω),精度等级**±1%**,属于工业级常规精度。该精度可保证分压、限流等基础电路的输出偏差控制在合理范围,无需额外校准,适合批量应用场景。
额定功率为125mW(0.125W),此为25℃环境下的连续工作功率上限。实际使用需遵循温度降额规则:环境温度超过25℃时,需根据松下官方曲线降低功率(如155℃时,允许功率约为额定值的50%),避免电阻过热失效。
温度系数为**±100ppm/℃**,表示阻值随温度变化的速率:每变化1℃,阻值变化约0.01%(100ppm=0.01%)。在工作温度范围(-55℃~+155℃)内,最大阻值变化量为210℃×0.01%=2.1%,结合±1%精度,总偏差范围±3.1%,满足工业场景温度稳定性需求。
宽温设计为**-55℃+155℃**,覆盖极寒(户外监测)到高温(汽车发动机舱)场景,优于普通消费电子电阻(通常0℃70℃)。
采用0805封装(英制:0.08″×0.05″;公制:2.0mm×1.25mm),体积小巧,适配高密度PCB布局(如智能手机、智能穿戴设备)。
基于厚膜工艺制造:以氧化铝陶瓷为基底,丝网印刷金属氧化物电阻浆料并高温烧结,表面覆盖玻璃釉保护层,平衡成本与性能,适合大规模量产。
符合无铅焊接(RoHS compliant)和有铅焊接工艺,可通过回流焊、波峰焊实现可靠焊接,焊接后抗振动性能优异。
抗振动(符合MIL-STD-202标准)和抗冲击性能优于插件电阻,可承受10g~20g振动加速度,适合车载、便携式设备。
额定条件下工作1000小时后,阻值变化率通常<0.5%,远低于行业1%标准,降低售后维护成本。
ERJ6ENF2201V以2.2kΩ±1%阻值、125mW功率、±100ppm/℃温度系数、-55℃~+155℃宽温为核心特性,兼具体积紧凑、可靠性高、成本适中的优势,是多领域基础电路的理想选择。松下成熟工艺与品牌保障,可满足批量生产对一致性和稳定性的需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products