WMSIC Electronic Components

ERJ2RKF24R9X

ModelERJ2RKF24R9X
Package0402
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ2RKF24R9X
Type
PANASONIC
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ2RKF24R9X
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
24.9Ω
Electronic Component
1
Electronic Component
BM0264850050
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ2RKF24R9X 厚膜贴片电阻产品概述

一、产品定位与核心参数

ERJ2RKF24R9X是松下(PANASONIC)针对小型化、高精度低功率场景推出的通用厚膜贴片电阻,核心参数明确了性能边界:

  • 标称阻值:24.9Ω(精准匹配中端电路阻值需求);
  • 精度等级:±1%(满足信号调理、模拟电路的一致性要求);
  • 额定功率:100mW(适配低功耗设备的功率承载);
  • 工作电压:50V(最大连续工作电压,需结合降额设计);
  • 温度系数:±100ppm/℃(宽温下阻值稳定性较好);
  • 温度范围:-55℃~+155℃(覆盖工业、部分汽车级环境)。

二、封装与物理特性

该电阻采用0402封装(公制尺寸约1.0mm×0.5mm×0.4mm,引脚间距0.5mm),是当前贴片电阻中尺寸较小的主流封装之一,适配高密度PCB设计(如智能手机、小型传感器节点)。

封装工艺为厚膜陶瓷基:在氧化铝陶瓷基板上印刷电阻浆料,经高温烧结形成电阻层,再制作电极与镀层(无铅合金,符合RoHS)。支持回流焊、波峰焊等贴片工艺,兼容自动贴装设备的高速生产,降低客户生产难度。

三、电气性能详解

1. 阻值精度与长期稳定性

±1%的精度可避免电路中因阻值偏差导致的信号失真(如音频模块的频率偏移)。厚膜工艺的长期漂移率低:额定工况下,阻值年漂移通常<0.1%,适合对长期可靠性有要求的应用(如工业传感器节点)。

2. 功率与电压降额设计

100mW是0402封装的典型功率等级,实际使用需注意温度降额:

  • 25℃(常温):满功率100mW;
  • 125℃(高温):功率降额至约60mW;
  • 155℃(极限):功率降额至约30mW。

50V最大工作电压需结合电路电压波动(如瞬态过压),避免击穿损坏。

3. 温度系数(TCR)的实际意义

±100ppm/℃表示:温度每变化1℃,阻值变化±0.01%。以24.9Ω为例,当温度从-55℃升至+155℃(温差210℃),阻值最大变化约±52mΩ,该变化量在多数电路中可忽略,保证宽温下的性能一致性。

四、环境适应性

ERJ2RKF24R9X的环境耐受性优于普通薄膜电阻:

  • 温度范围:覆盖工业级(-40℃~+85℃)与部分汽车级(非关键系统)的高低温需求;
  • 湿度与腐蚀:厚膜结构对湿度、弱化学腐蚀(如工业环境中的少量油污)耐受性较好;
  • 环保合规:符合RoHS 2.0、REACH指令,无铅无卤,满足全球市场准入要求。

五、典型应用场景

  1. 消费电子:智能手机/平板的音频模块、传感器接口(如加速度计、光线传感器的信号调理);
  2. 工业控制:小型PLC、远程传感器节点的前置放大电路(如温度、压力传感器的信号滤波);
  3. 电源模块:低功率DC-DC转换器的限流电阻、反馈电阻(如5V转3.3V模块);
  4. 汽车电子:车载信息娱乐系统的蓝牙模块、USB接口的限流电路(非安全关键系统);
  5. 医疗设备:便携式医疗仪器(如血糖监测仪、血氧仪)的低功率信号处理电路。

六、品牌与可靠性优势

松下作为全球元器件龙头,该产品具备:

  • 成熟工艺:厚膜电阻生产线采用自动化控制,阻值一致性优于行业平均;
  • 严格验证:每批次经过阻值测试、温度循环(-55℃~+155℃,1000次)、湿度测试(85℃/85%RH,1000小时)等可靠性验证,不良率<0.01%;
  • 技术支持:提供详细datasheet与应用指南,便于工程师选型与电路优化。

综上,ERJ2RKF24R9X以高性价比、宽温稳定、小型化等特点,成为消费电子、工业控制等领域的主流贴片电阻选择。

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