WMSIC Electronic Components

ERJ3EKF4871V

ModelERJ3EKF4871V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ3EKF4871V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ3EKF4871V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
4.87kΩ
Electronic Component
1
Electronic Component
BM0264224050
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

松下ERJ3EKF4871V厚膜贴片电阻产品概述

一、产品基本定位

松下ERJ3EKF4871V是一款0603封装通用型厚膜贴片电阻,聚焦低功耗电路的基础功能需求,兼顾精度、体积与环境适应性,可覆盖工业控制、消费电子、通信设备等多领域的匹配、分压、限流场景,属于松下电阻产品线中性价比突出的常规型号。

二、核心性能参数详解

该电阻的关键参数精准匹配通用电路的设计需求,具体如下:

  1. 阻值与精度:标称阻值为4.87kΩ(4870Ω),精度等级为**±1%**——此精度可满足信号调理、分压网络等对阻值匹配要求不极端的场景,避免因精度偏差导致的电路性能偏移;
  2. 功率与电压:额定功率100mW,最大工作电压75V——适配低功耗电路(如传感器信号放大、微控制器外围电路),电压上限覆盖多数直流/低频交流电路的工作范围;
  3. 温度特性:温度系数为**±100ppm/℃,工作温度范围-55℃~+155℃**——温度系数处于厚膜电阻常规水平,可抑制环境温度变化带来的阻值漂移;宽温范围支持工业现场(户外设备、高温车间)及部分汽车电子基础应用;
  4. 工艺类型:采用厚膜工艺——相比薄膜电阻成本更低,相比线绕电阻体积更小,兼顾性价比与长期稳定性。

三、封装与物理尺寸

ERJ3EKF4871V采用0603英制贴片封装(对应公制1608,尺寸约1.6mm×0.8mm×0.45mm),具有以下优势:

  • 体积紧凑:适配高密度PCB设计(如智能手机、智能穿戴、小型工业模块),有效节省电路空间;
  • 贴装兼容:符合SMT自动化生产标准,可通过常规贴片机高速贴装,提升生产效率;
  • 机械稳定:贴片封装抗振动、抗冲击性能优于插件电阻,适合移动设备或工业振动环境。

四、典型应用场景

结合参数特性,该电阻主要适用于以下场景:

  1. 工业控制电路:PLC输入输出模块分压电阻、传感器信号调理限流电阻(宽温范围适配工业现场温度波动);
  2. 消费电子设备:智能手机、智能音箱的电源滤波、LED指示灯限流(小体积适配便携设备紧凑设计);
  3. 通信设备:路由器、交换机的信号衰减网络、偏置电路(±1%精度满足信号匹配需求);
  4. 汽车电子基础电路:车载仪表盘背光驱动、传感器接口电路(-55℃~+155℃覆盖车载温度范围);
  5. 电源管理模块:DC-DC转换器反馈分压、线性稳压器输出限流(100mW功率适配小功率电源设计)。

五、可靠性与环境适应性

松下厚膜工艺与品质管控保障了产品可靠性:

  • 环境耐受:除宽温范围外,可耐受0~95%RH湿度(无凝露)、盐雾腐蚀(符合JIS C 5016标准),适合潮湿或沿海地区设备;
  • 机械可靠:通过振动测试(10~2000Hz,98m/s²加速度)与冲击测试(1000m/s²,11ms),适应运输或使用中的机械应力;
  • 长期稳定:厚膜电阻膜附着力强,长期使用阻值漂移小,典型寿命超10000小时。

六、品牌与选型优势

作为松下常规电阻型号,ERJ3EKF4871V具有以下优势:

  1. 品质一致:生产工艺严格,阻值、温度系数等参数一致性好,减少批量应用波动;
  2. 环保合规:符合RoHS、REACH标准,无铅封装适配绿色制造;
  3. 供货稳定:作为成熟型号,供货周期短,满足批量生产需求;
  4. 选型兼容:0603封装与同系列其他阻值电阻可互换贴装,方便电路设计与BOM管理。

该产品凭借均衡的性能与可靠的品质,成为多领域基础电路设计的优选元件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.