WMSIC Electronic Components

ERJ3EKF3011V

ModelERJ3EKF3011V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ3EKF3011V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ3EKF3011V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
3.01kΩ
Electronic Component
1
Electronic Component
BM0264567834
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ3EKF3011V 产品概述

一、产品基本参数

  • 型号:ERJ3EKF3011V(PANASONIC)
  • 类型:厚膜贴片电阻(精密级)
  • 阻值:3.01 kΩ
  • 精度:±1%
  • 额定功率:100 mW
  • 额定工作电压:150 V(铭牌项)
  • 温度系数(TCR):±100 ppm/℃(±0.01%/℃)
  • 工作温度范围:-55℃ ~ +155℃

二、特性与结构要点

ERJ3EKF3011V 属于厚膜工艺的高可靠性贴片电阻,提供紧凑的体积与工业级温度范围。±1% 的阻值公差适合精密分压、滤波和阻抗匹配场合;±100 ppm/℃ 的 TCR 在厚膜产品中属于常见水平,兼顾成本与温漂性能。额定功率 100 mW 适合低功耗信号链与便携设备中的偏置/取样用途。

三、关键性能解读与使用注意

  • 电压与功率关系:尽管铭牌写有“工作电压 150 V”,但在电阻上连续施加电压时必须同时满足功率限制。根据 P = V^2 / R,可算出在 3.01 kΩ、100 mW 条件下的连续最大电压约为 √(0.1×3010) ≈ 17.4 V。超过该电压会使功率超标而损坏元件。铭牌的高电压值通常指绝缘/耐压或短时耐受能力,使用时务必以功率极限为准。
  • 温漂:±100 ppm/℃ 意味着每升高 1℃ 电阻约变化 0.01%;例如从 25℃ 到 125℃(Δ100℃)最大变化约为 ±1.0%。若电路要求更高稳定性,应考虑低 TCR 的金属膜/薄膜产品。
  • 工作温度与可靠性:-55℃~+155℃ 的额定温度范围表明可用于较宽的工业温区,但在高温环境下需进行功率降额(derating)以保证长期稳定性。
  • 厚膜特性:相比薄膜/金属膜,厚膜电阻在噪声、长期稳定性和温漂上通常略逊一筹,但成本较低且适合常规精度应用。

四、典型应用场景

精密分压器、ADC 前端阻抗、偏置网络、滤波电阻、便携式与工业控制电子、通信设备中低功耗信号处理等场合均适用。

五、PCB 布局与焊接建议

  • 贴片焊接兼容常规 SMT 工艺,建议遵循厂家推荐的回流焊温度曲线;避免超长高温暴露以防阻值漂移。
  • 布局时考虑热源和散热通道,尽量避免将高耗器件紧邻电阻;在高温环境下采用功率降额。
  • 清洗时注意避免长时间超声振动或强溶剂浸泡,以免影响封装与端电极。

六、选型提示

若电路对温漂和噪声敏感,建议评估更低 TCR(如 ±25 ppm/℃)或金属膜系列;若需要更高电压承受能力,应重新核算功率条件或选用大阻值/更高功率等级器件。最终选型请参考松下官方数据手册以获取完整的温升、寿命和封装信息。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.