WMSIC Electronic Components

ERJ3EKF2700V

ModelERJ3EKF2700V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ3EKF2700V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ3EKF2700V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
270Ω
Electronic Component
1
Electronic Component
BM0265110995
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ3EKF2700V 厚膜贴片电阻产品概述

一、产品定位与核心属性

ERJ3EKF2700V是松下(PANASONIC)推出的小型化厚膜贴片电阻,属于常规功率级高精度电阻范畴。其核心定位是兼顾高密度PCB布局需求、阻值精度与环境稳定性,同时控制成本,适用于消费电子、工业控制等多领域的小型电路设计,是量产场景中替代低成本电阻的可靠选择。

二、基础电气参数详解

该电阻的关键参数直接决定其应用边界与性能表现,具体解析如下:

  • 阻值与精度:标称阻值270Ω,精度±1%。相比常见的±5%精度电阻,±1%的偏差可有效降低分压、信号调理等场景的匹配误差,批量应用时无需额外筛选即可保证电路一致性;
  • 功率额定值:100mW(0.1W),为0603封装电阻的典型功率等级。实际使用需注意功耗限制(计算方式:(P=I^2R=U^2/R)),避免过热导致阻值漂移;
  • 工作电压限制:最大直流/交流电压75V,是电阻绝缘层的耐压阈值,超过可能引发击穿短路,设计时需结合电路电压校验;
  • 温度系数(TC):±100ppm/℃,即温度每变化1℃,阻值变化±0.01%。例如,从25℃升至155℃(变化130℃),阻值仅变化±0.013%,远低于多数低成本电阻的温漂,宽温环境下稳定性突出。

三、封装与物理特性

采用0603封装(英制命名,对应公制1.6mm×0.8mm),属于小型贴片封装,适配表面贴装技术(SMT)自动贴装,可显著提升生产效率。电阻采用厚膜工艺制造:通过丝网印刷将电阻浆料涂覆在陶瓷基板上,经高温烧结形成稳定电阻膜,兼具成本优势与可靠性。

四、环境适应性表现

工作温度范围覆盖**-55℃+155℃**,远超商用级电阻(070℃)的温区能力,属于工业级宽温设计:

  • 低温端:-55℃可满足极地设备、航空航天辅助电路等极端低温场景;
  • 高温端:+155℃可适配高温工业设备(如电机控制器、加热模块)、汽车电子(部分低功耗场景)等高温环境;
    此外,厚膜工艺的电阻膜长期漂移率低,经温度循环、湿度测试后性能稳定,适合对可靠性要求较高的场景。

五、典型应用场景

结合参数与特性,ERJ3EKF2700V的典型应用包括:

  • 消费电子:智能手机电池电量检测分压电路、音频滤波网络、LED背光限流电阻;
  • 工业控制:小型PLC的I/O接口电阻、传感器信号调理(如压力/温度传感器偏置)、小型电机驱动限流;
  • 通信设备:路由器信号匹配电阻、电源模块反馈电阻;
  • 汽车电子:车载信息娱乐系统按键电路、仪表盘背光驱动限流(低功耗场景)。

六、品牌与品质背书

松下作为全球电子元器件龙头,其厚膜电阻工艺成熟,批量一致性好,符合RoHS、REACH等环保指令。ERJ3EKF2700V经过振动、温度循环等可靠性测试,可满足量产品质需求,同时松下提供完善的技术支持与售后保障。

总结

ERJ3EKF2700V凭借小型化封装、±1%高精度、宽温适应性与可靠品质,成为小型电路设计中常规功率电阻的优选方案,适用于对精度、稳定性有一定要求的量产场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.