WMSIC Electronic Components

ERJ3EKF3001V

ModelERJ3EKF3001V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ3EKF3001V
Type
PANASONIC
Minimum package
5000

Technical parameters

Power
100mW
Electronic Component
PANASONIC
Electronic Component
ERJ3EKF3001V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
3kΩ
Electronic Component
1
Electronic Component
BM0229252970
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ3EKF3001V 精密厚膜贴片电阻器产品概述

一、产品基本信息

ERJ3EKF3001V是松下(PANASONIC)推出的精密级厚膜贴片电阻器,属于该品牌针对中高精度电子电路开发的经典系列。产品采用贴片式封装,专为需要稳定阻值控制、紧凑布局的电子设备设计,广泛适配工业控制、消费电子、仪器仪表等领域的信号调理、分压偏置、电流限制等应用场景。

二、核心性能参数详解

1. 阻值与精度

产品标称阻值为3kΩ(3000Ω),精度等级达到**±1%**——这一参数可满足多数精密电路对阻值偏差的要求(如传感器信号放大、电源反馈回路等),避免因阻值误差导致的电路性能偏移。

2. 功率与电压承载

额定功率为100mW(0.1W),适用于小功率信号处理场景(如低功耗MCU的周边电路);最大工作电压为75V,在常见直流/交流电路中电压裕量充足,可有效避免过压击穿风险。

3. 温度特性

温度系数(TCR)为**±100ppm/℃**,即环境温度每变化1℃,阻值变化幅度不超过±0.01%。这一特性确保了产品在宽温度范围内的阻值稳定性,减少了温度波动对电路性能的影响。

4. 工作温度范围

覆盖**-55℃至+155℃**,满足工业级环境的高低温需求(如户外设备、车载辅助系统等),同时兼容消费电子的常规工作温度区间。

三、封装与适用场景

产品采用0603封装(英制规格,对应公制1608,尺寸为1.6mm×0.8mm),体积小巧,适合高密度PCB设计(如智能手机、智能穿戴设备的主板)。具体适用场景包括:

  • 工业控制:PLC模块的信号输入/输出回路、温度传感器的调理电路;
  • 消费电子:音频设备的滤波网络、显示驱动的偏置电路;
  • 仪器仪表:万用表的分压电路、数据采集卡的信号放大回路。

四、可靠性与环境适应性

  1. 厚膜技术优势:采用厚膜电阻工艺,兼具成本优势与精度表现,相比碳膜电阻精度更高,相比薄膜电阻更适合批量应用;
  2. 工艺稳定性:松下激光微调技术确保每颗电阻的阻值一致性,批次间偏差极小;
  3. 抗环境冲击:宽工作温度范围+低温度系数,可承受高低温循环、湿度变化等环境应力,长期使用性能稳定;
  4. 长寿命设计:在额定条件下使用寿命可达数万小时,减少电路维护成本与故障率。

五、品牌与质量保障

松下作为全球电子元器件领域的头部厂商,其电阻产品通过严格的质量体系认证(如ISO9001、IATF16949等),生产过程遵循行业最高标准。ERJ3EKF3001V经过市场多年验证,广泛应用于国内外知名品牌的终端产品,选型风险低,可放心用于各类中高端电子设备。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.