Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERJ3EKF2801V为松下厚膜贴片电阻,核心参数明确匹配工业级基础应用需求,命名逻辑与参数一一对应:
命名中“ERJ”为松下贴片电阻系列标识,“3”对应100mW功率等级,“E”代表±1%精度,“KF”指向±100ppm/℃温度系数,参数与命名逻辑一致。
该封装采用表面贴装技术(SMT)兼容设计,无引脚结构可直接焊接于PCB表面,节省布线空间的同时,适配自动化贴装产线,提升生产效率;尺寸紧凑(1.6mm×0.8mm),适合便携设备、小型模块等对体积敏感的场景,可与同封装电容、电感等元器件高密度布局。
采用厚膜印刷工艺(丝网印刷电阻浆料于氧化铝陶瓷基底),相比薄膜电阻成本更低,且抗ESD(静电放电)能力更强;表面覆盖玻璃釉保护层,提升抗湿度、抗腐蚀性能,长期使用稳定性优于碳膜电阻,在工业环境中可保持低漂移率。
松下厚膜电阻工艺经过长期可靠性测试,在工作温度范围内阻值漂移率低(典型长期漂移≤0.5%/1000小时),抗机械应力(如振动、冲击)性能满足IPC-A-610标准,可适应工业现场的振动环境。
该产品凭借“小型化、低功耗、宽温稳定”的特点,成为工业控制、消费电子等领域基础电路的高性价比选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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