WMSIC Electronic Components

ERJ3EKF2801V

ModelERJ3EKF2801V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ3EKF2801V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ3EKF2801V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
2.8kΩ
Electronic Component
1
Electronic Component
BM0264567839
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ3EKF2801V 厚膜贴片电阻产品概述

一、核心参数与命名解析

ERJ3EKF2801V为松下厚膜贴片电阻,核心参数明确匹配工业级基础应用需求,命名逻辑与参数一一对应:

  • 阻值与精度:标称阻值2.8kΩ(命名中“2801”为代码,代表28×10¹Ω),精度±1%,满足信号调理、分压电路等对阻值一致性的基础要求;
  • 功率与电压:额定功率100mW,最大工作电压75V,计算最大工作电流约1.33mA,适配低功耗电路场景;
  • 温度特性:温度系数±100ppm/℃,工作温度范围-55℃~+155℃,温差210℃时阻值漂移约2.1%,结合精度指标后总误差仍在工程可接受范围;
  • 封装类型:0603(英制)/1608(公制)贴片封装,尺寸1.6mm×0.8mm,适配小型化PCB设计。

命名中“ERJ”为松下贴片电阻系列标识,“3”对应100mW功率等级,“E”代表±1%精度,“KF”指向±100ppm/℃温度系数,参数与命名逻辑一致。

二、封装与工艺特征

1. 0603封装优势

该封装采用表面贴装技术(SMT)兼容设计,无引脚结构可直接焊接于PCB表面,节省布线空间的同时,适配自动化贴装产线,提升生产效率;尺寸紧凑(1.6mm×0.8mm),适合便携设备、小型模块等对体积敏感的场景,可与同封装电容、电感等元器件高密度布局。

2. 厚膜工艺特性

采用厚膜印刷工艺(丝网印刷电阻浆料于氧化铝陶瓷基底),相比薄膜电阻成本更低,且抗ESD(静电放电)能力更强;表面覆盖玻璃釉保护层,提升抗湿度、抗腐蚀性能,长期使用稳定性优于碳膜电阻,在工业环境中可保持低漂移率。

三、性能匹配与典型应用

(一)性能适配性

  • 低功耗场景:100mW功率额定值满足多数信号处理电路(如滤波、分压、偏置)的功耗需求,避免功率过载;
  • 温度稳定性:-55℃~+155℃宽温范围覆盖工业级、部分车载辅助电路(如座舱内低功率模块)的环境要求;
  • 成本与性能平衡:±1%精度、±100ppm/℃温度系数的组合,在基础工业应用中无需追求更高精度(如±0.1%薄膜电阻),有效控制BOM成本。

(二)典型应用场景

  1. 消费电子:蓝牙耳机、智能手环等便携设备的信号分压电路、LED指示灯限流电阻;
  2. 工业控制:小型传感器(如温度、压力传感器)的信号调理电路、PLC辅助模块的偏置电阻;
  3. 通信设备:基站辅助电源模块的分压电阻、小型通信模块的滤波电路;
  4. 汽车电子:车载USB充电模块的限流电阻、座舱内显示模块的辅助电阻(需结合具体应用的温度等级匹配)。

四、可靠性与选型注意事项

1. 可靠性验证

松下厚膜电阻工艺经过长期可靠性测试,在工作温度范围内阻值漂移率低(典型长期漂移≤0.5%/1000小时),抗机械应力(如振动、冲击)性能满足IPC-A-610标准,可适应工业现场的振动环境。

2. 选型限制

  • 不适合高功率场景(需≥1/8W功率时应选0805或更大封装);
  • 高频应用(如RF电路)性能弱于薄膜电阻(厚膜电阻寄生电感、电容较高);
  • 高精度场景(如计量电路)需替换为±0.1%精度的薄膜电阻。

该产品凭借“小型化、低功耗、宽温稳定”的特点,成为工业控制、消费电子等领域基础电路的高性价比选择。

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