WMSIC Electronic Components

AXE530127D

ModelAXE530127D
PackageSMD,P=0.4mm
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC AXE530127D
Type
PANASONIC
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
AXE530127D
Electronic Component
1
Package
SMD,P=0.4mm
Electronic Component
2
Electronic Component
and Connector
Electronic Component
0.084g
Electronic Component
0.4mm
PIN
30P
Electronic Component
1
Electronic Component
BM0264224055
Electronic Component
Electronic Component
Operating Temperature
55℃~+85℃
Electronic Component
Electronic Component
Voltage
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AXE530127D 产品概述(PANASONIC 松下)

一、产品简介

AXE530127D 为 PANASONIC(松下)系列的高密度板对板/背板连接器,规格为 30P、间距 0.4mm、立贴(垂直贴装)形式,双排设计(2 rows)。该器件定位于需要高密度信号互连与小型化装置中,适用于子板与主板、模组与主板之间的可靠高速信号传输场合。

二、主要参数概览

  • 引脚数:30P(30 引脚)
  • 芯距:0.4 mm(高密度排布)
  • 安装方式:SMD(立贴/垂直贴装)
  • 排数:2(双排)
  • 类型:板对板 / 背板连接器
  • 品牌:PANASONIC(松下)
  • 封装信息:以厂方资料为准

注:关于额定电流、电压、接触电阻、插拔寿命与环境温度等精确电气/机械参数,请参照松下官方规格书与产品数据手册以确保设计匹配。

三、结构与外形特点

AXE530127D 采用 0.4mm 间距的紧凑式针座设计,双排立贴结构有效节省 PCB 面积,利于多引脚信号在有限空间内实现布线。立贴形式便于在 SMT 流程中与其他表面贴装元件一同回流焊接,提升自动化装配效率。连接器接触件通常采用具有弹性的金属簧片结构,保证接触可靠性与一定的抗震性能。

四、性能与优势

  • 高密度:0.4mm 芯距适合小型化设备及模组化设计,支持更多信号引出。
  • SMT 兼容:立贴脚位适用于常规回流工艺,便于与现行生产线整合。
  • 双排设计:提供更高的引脚数量而不显著增加占板面积,便于布线与差分对排列。
  • 品牌支持:松下作为成熟连接解决方案供应商,资料、模具与技术支持较为完善。

五、典型应用场景

  • 手机、平板与便携式设备内部子板互联
  • 相机模块、显示模组(LCD、OLED)连接
  • 无线通信设备、网络设备的子板到主板连接
  • 工业控制与嵌入式系统中高密度信号互联

六、设计与使用建议

  • 布局:遵循厂方推荐的焊盘尺寸与间距,避免焊盘过大或过小影响焊接质量。
  • 焊接:使用与厂方一致的回流焊曲线,注意预热与回流峰值温度限制,防止连接器变形或接触件退火。
  • SMT 贴装:采用合适的治具与取放头,立贴结构对贴装定位精度要求较高。
  • 可靠性:设计时考虑插拔力与插拔次数,必要时在样机验证中测试插拔寿命与接触电阻随时间变化。
  • EMC/信号完整性:高速差分信号布线时注意差分对一致性与接地屏蔽,必要时做阻抗仿真与线长匹配。

七、选型与注意事项

在最终选型前,请核实 AXE530127D 的完整数据手册,确认电气额定值、插拔寿命、表面处理、机械高度(stacking height)等关键参数是否满足项目需求。如需替代产品或不同堆叠高度、直插/侧插等变型,可咨询松下或授权分销商获取对应型号与 3D/PCB 封装库文件。

如需,我可以帮您整理 AXE530127D 的参考数据检查项清单、常见 PCB 焊盘尺寸建议或与同类 0.4mm 连结器的对比分析。

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