WMSIC Electronic Components

ERJ2GEJ2R0X

ModelERJ2GEJ2R0X
Package0402
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ2GEJ2R0X
Type
PANASONIC
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ2GEJ2R0X
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.011g
Electronic Component
2Ω
Electronic Component
1
Electronic Component
BM0264567843
Operating Temperature
55℃~+155℃
Operating Voltage
100V
Electronic Component
100ppm/℃~+600ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ2GEJ2R0X 厚膜贴片电阻产品概述

一、产品基本属性

ERJ2GEJ2R0X是松下(PANASONIC) 推出的一款厚膜贴片电阻,采用行业通用的0402封装(尺寸约1.0mm×0.5mm),属于小型化、低功率电阻范畴。该产品专为高密度PCB布局及低功耗电路设计,是消费电子、工业控制、汽车电子等领域的常规选型元件,兼具成本优势与可靠性。

二、核心技术参数

该电阻的关键参数符合行业标准及松下产品规范,具体如下:

参数项 规格值 核心说明 电阻类型 厚膜电阻 丝网印刷+高温烧结工艺,抗老化、稳定性佳 标称阻值 2Ω 低阻值设计,适配电流检测、分压等场景 精度等级 ±5% 常规精度,满足大多数工程应用需求 额定功率 100mW(0.1W) 低功耗,适配移动设备、可穿戴等续航敏感电路 最大工作电压 100V 电压裕量充足,避免过压损坏 温度系数(TCR) -100ppm/℃ ~ +600ppm/℃ 温度变化时阻值漂移范围,常规环境影响可忽略 工作温度范围 -55℃ ~ +155℃ 宽温设计,覆盖工业、汽车等极端环境 封装尺寸 0402(英制) 1.0mm(长)×0.5mm(宽)×0.35mm(厚)

三、设计与工艺特点

3.1 小型化封装适配高密度布局

0402封装是目前贴片电阻中最小规格之一,可大幅节省PCB空间,适合智能手机、智能手表、光模块等对体积要求严苛的产品。其表面贴装结构支持自动化贴装,生产效率高,降低制造成本。

3.2 厚膜工艺保障长期稳定性

采用厚膜电阻技术,在陶瓷基底上印刷电阻浆料并高温烧结形成电阻层,具有抗潮湿、抗老化的特点——长期使用阻值漂移小,可靠性优于部分低成本薄膜电阻方案。

3.3 功率与电压的合理匹配

额定功率100mW与最大工作电压100V完全匹配:当电压达100V时,电流为1mA(P=U×I=0.1W),刚好达到额定功率;若电流为0.224A(√(0.1/2)),则电压仅0.448V,远低于100V,参数设计无冗余或不足。

四、典型应用场景

ERJ2GEJ2R0X因体积小、低功耗、宽温特性,广泛应用于以下领域:

  1. 消费电子:智能手机/平板电源管理模块(电流检测电阻)、智能手表传感器电路(信号分压);
  2. 汽车电子:胎压监测系统(TPMS)、车身控制模块(BCM)辅助电路(工作温度覆盖-40℃~125℃);
  3. 工业控制:PLC输入/输出模块、小型传感器信号调理电路(宽温适配车间极端环境);
  4. 通信设备:基站光模块、路由器无线模块(高密度PCB布局需求);
  5. 可穿戴设备:智能手环、蓝牙耳机电源滤波/分压电路(低功耗匹配续航要求)。

五、可靠性与环境适应性

该电阻符合IEC 60115-1(固定电阻器通用标准)及松下内部可靠性规范,关键测试表现如下:

  • 温度循环:-55℃~155℃,1000次循环后阻值变化≤±0.5%;
  • 湿度测试:40℃/93%RH,1000小时后阻值变化≤±1%;
  • 振动测试:10Hz~2000Hz,加速度10g,持续2小时无开路/短路;
  • 冲击测试:1000m/s²(约102g),持续1ms,3次冲击后性能正常。

宽温范围(-55℃~155℃)可覆盖汽车发动机舱(最高约150℃)、工业户外设备(最低-40℃)等极端环境,满足多场景可靠性需求。

六、选型与使用注意事项

为保障产品性能及寿命,需注意以下要点:

  1. 降额使用:实际功耗建议不超过额定功率的80%(即80mW),避免长期过载导致阻值漂移;
  2. 焊接工艺:回流焊峰值温度≤260℃(持续≤30秒),波峰焊温度≤250℃(持续≤5秒),避免高温损坏电阻层;
  3. 静电防护:贴片电阻对ESD敏感,操作时需戴静电手环、使用静电袋,工作台接地;
  4. 存储条件:未开封产品存储于25℃/60%RH以下环境,开封后168小时内完成焊接,避免吸潮导致焊接爆锡;
  5. 布局要求:与相邻元器件间距≥0.2mm,避免热干扰影响阻值稳定性。

ERJ2GEJ2R0X凭借小型化、宽温、低功耗及高可靠性,成为多领域电路设计的实用选型,尤其适合对体积和环境适应性要求高的应用场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.