Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
EEEFT1V101AP
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- PANASONIC EEEFT1V101AP
- Type
- PANASONIC
- Unit
- Electronic Component
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- EEEFT1V101AP
- Electronic Component
- 1
- Electronic Component
- 100uF
- Package
- SMD,D6.3xL5.8mm
- Electronic Component
- SMD Aluminum Electrolytic Capacitor
- Electronic Component
- ±20%
- Electronic Component
- 0.776g
- Electronic Component
- 1
- Electronic Component
- BM69415137
- Electronic Component
- 2000hrs@105℃
- Operating Temperature
- 55℃~+105℃
- Current
- 300mA@100kHz
- Voltage
- 35V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EEEFT1V101AP 产品概述
产品简介
EEEFT1V101AP 是一款高性能的贴片型铝电解电容，具有100μF的电容量，额定电压为35V，精度为±20%。该产品由日本松下（PANASONIC）公司设计与生产，广泛应用于电子设备中，尤其是在需要高稳定性和耐久性部件的场合。其压缩的外观尺寸为6.3mm（直径）x 5.8mm（长度），使其非常适合在紧凑的电路板中使用。
技术参数
- 容量：100μF
- 额定电压：35V
- 容差：±20%
- 额定纹波电流：300mA @ 100kHz
- 工作寿命：2000小时 @ 105℃
- 工作温度范围：-45℃ 到 +105℃
- 封装类型：SMD（表面贴装器件）
- 外观尺寸：6.3 x 5.8mm
特性与优势
高温工作能力：EEEFT1V101AP 能够在高达105℃的环境下连续工作，且具有长达2000小时的使用寿命。这使得它特别适合于高温应用环境，例如汽车电子、工业控制和家电设备。
优秀的频率特性：该电容在100kHz下的额定纹波电流为300mA，表现出良好的高频特性，这增加了它在开关电源和高频应用中的适用性。
广泛的工作温度范围：EEEFT1V101AP 的工作温度范围从-45℃到+105℃，使其能够在极端的温度条件下稳定运行，适合应用于各种严苛环境。
小型化设计：该电容的紧凑型外观（D6.3xL5.8mm）使其非常适合现代小型电子设备的需求，能够节省电路板空间，提高设计灵活性。
可靠性和耐久性：松下作为全球知名的电气元件制造商，其产品在可靠性和制造质量上都享有良好的声誉。EEEFT1V101AP 的设计考虑了长期使用中的老化问题，确保其性能在使用过程中能够长期稳定。
应用领域
EEEFT1V101AP 铝电解电容广泛应用于以下领域：
- 消费电子产品：如电视、音响设备等，提供平稳的电源供应。
- 汽车电子：在车载电源模块中，提供高频稳定性与高温耐性。
- 工业控制：用于电机驱动、变频器和其他控制系统中。
- 通信设备：在各种通信电路和网络设备中，以确保电源的稳定性和可靠性。
总结
EEEFT1V101AP 是一款性能优越的贴片铝电解电容，凭借其高温耐受能力、广泛的工作温度范围及优秀的电流承受能力，成为诸多应用中的理想选择。无论是在高频应用还是在要求严苛的环境中，松下的这一产品都能提供持久的性能和高可靠性，是设计工程师在选择电容产品时值得信赖的选择。通过整合卓越的设计与可靠的制造，EEEFT1V101AP 有助于推动各类电子产品的发展与升级。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
