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ERA2AEB151X
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERA2AEB151X
- Type
- PANASONIC
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 63mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERA2AEB151X
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±0.1%
- Electronic Component
- 0.011g
- Electronic Component
- 150Ω
- Electronic Component
- 1
- Electronic Component
- BM0264567899
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERA2AEB151X 产品概述
一、概述
ERA2AEB151X 为松下（PANASONIC）生产的薄膜贴片电阻，0402（约1.0 mm × 0.5 mm）封装，标称阻值 150 Ω，精度 ±0.1%，额定功率 63 mW，额定工作电压 50 V，温度系数（TCR）±25 ppm/℃，工作温度范围 -55℃ 至 +155℃。该型号以高精度、低噪声和优良的温度稳定性，适合高密度 SMT 电路和精密测量场合。
二、关键电气参数与使用限制
- 阻值：150 Ω ±0.1%（高精度，适合精密分压、参考与阻抗匹配）。
- 功率与电压限制：额定功率 63 mW。根据功率限制得到的最大直流电流 Imax = sqrt(P/R) ≈ 20.5 mA，对应的最大跨端电压因功率限制为 V = I·R ≈ 3.07 V。虽然器件额定工作电压为 50 V，但在实际应用中需同时满足功率与电压两者限制，实际允许的跨端电压应取二者的较小值。
- 温度系数：±25 ppm/℃，即每升高 1℃ 大约改变 0.0025%，长温度变化下（如 100℃）累计影响约 0.25%，设计时应考虑温漂与配套温度补偿。
三、可靠性与环境适配
该薄膜电阻适应宽温区（-55℃~+155℃），适合汽车电子、工业控制等苛刻环境。薄膜结构通常具有较低的长期漂移与较好噪声特性，符合无铅回流焊工艺，常见符合 RoHS 要求。具体可靠性指标（如寿命、老化率）建议参考厂商数据表与认证报告。
四、典型应用场景
- 精密分压器与参考网络（ADC/DAC 前端）
- 传感器信号调理与桥路平衡
- 高密度便携设备中的精密偏置与阻抗匹配
- 精密滤波电路中的阻值元件
五、PCB 设计与装配建议
- 尺寸与贴装：0402 小封装适合高密度布局，焊盘设计按制造商推荐尺寸，保证焊接可靠性与热散布。
- 热功率管理：尽量不在接近额定功率的条件下长期工作，建议留有足够裕量（降额运行）。
- 焊接工艺：支持无铅回流，遵循 JEDEC/厂商的回流曲线峰值温度与时间限制，避免过高峰值或过长加热导热导致电阻值漂移。
- 测试测量：电路调试与校准时若需高精度测量，建议采用四端/开路补偿测量法以降低接触与导线误差。
六、选型与替代注意事项
在选择时应综合考虑阻值精度、TCR、功率、封装尺寸与环境要求。若工作环境温度剧变或要求更高的温度稳定性，可考虑更低 TCR 或更大封装的薄膜电阻；若需要更高功率或更高工作电压，则选择更大封装或电阻值更高的器件。常见品牌有多家可提供相同性能的薄膜电阻，选型时对比数据表与可靠性认证为宜。
如需元件数据表、推荐焊盘尺寸或实际温漂与长期稳定性测试数据，可提供具体资料以便进一步核对与设计验证。
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