WMSIC Electronic Components

ERJ2GEJ471X

ModelERJ2GEJ471X
Package0402
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ2GEJ471X
Type
PANASONIC
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ2GEJ471X
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.011g
Electronic Component
470Ω
Electronic Component
1
Electronic Component
BM0264850041
Operating Temperature
55℃~+155℃
Operating Voltage
100V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ2GEJ471X 厚膜贴片电阻产品概述

一、产品基本定位

ERJ2GEJ471X是松下(PANASONIC) 推出的通用型厚膜贴片电阻,采用行业标准0402(英制)封装,针对低功耗、高密度贴装场景设计,兼顾阻值稳定性与成本优势,广泛适配消费电子、工业控制、汽车电子等多领域的电路需求。

二、核心性能参数详解

该电阻的关键参数明确了应用边界与性能表现:

  1. 阻值与精度:标称阻值470Ω(标识代码“471”,表示47×10¹Ω),精度等级±5%,满足多数通用电路对阻值误差的要求,无需高精度场景下可有效控制成本;
  2. 功率等级:额定功率100mW(0.1W),适用于低功耗电路的信号调理、分压、限流等功能,需注意实际电路功耗不得超过额定值(计算最大工作电流≈14.5mA,最大压降≈6.8V);
  3. 工作电压:最大工作电压100V,需避免电路电压超过此限值,防止绝缘击穿或性能退化;
  4. 温度系数(TCR):±200ppm/℃,表示温度每变化1℃,阻值变化±200×10⁻⁶倍,例如温度从25℃升至155℃(变化130℃),阻值变化约±1.22Ω,宽温下仍能保持电路功能稳定;
  5. 工作温度范围:-55℃+155℃,覆盖工业级(-40+85℃)与部分汽车级(-40~+150℃)场景,可适应高低温交替的 harsh 环境。

三、封装与物理特性

采用0402封装(英制尺寸:长0.04英寸,宽0.02英寸;公制对应1005:长1.0mm,宽0.5mm),是小尺寸贴片电阻的典型规格,具备以下优势:

  • 高密度贴装:适合PCB空间紧凑的设计(如智能手机、可穿戴设备),可大幅提升单位面积的元件集成度;
  • 工艺兼容性:支持回流焊、波峰焊等主流贴片工艺,贴装效率高,适配自动化生产流程;
  • 尺寸一致性:松下品控严格,封装尺寸公差小,减少贴装不良率。

四、可靠性与环境适应性

作为厚膜贴片电阻,ERJ2GEJ471X具备稳定的可靠性表现:

  • 厚膜工艺优势:通过丝网印刷、烧结工艺形成致密电阻层,抗冲击、抗振动性能优于薄膜电阻,适合机械应力较大的场景;
  • 宽温稳定性:工作温度范围覆盖-55~+155℃,可应对工业现场的季节温差、车载环境的温度波动;
  • 品牌品质保障:松下被动元件品控体系成熟,产品一致性好,批量应用时不良率低,降低售后维护成本。

五、典型应用场景

ERJ2GEJ471X的参数与封装特性,使其适配以下常见场景:

  1. 消费电子:智能手机、平板的电源管理模块(分压检测)、音频信号滤波电路、LED指示灯限流;
  2. 工业控制:小型PLC的输入输出接口电路、传感器信号调理(如温度传感器分压)、低压电机驱动辅助限流;
  3. 汽车电子:车载信息娱乐系统控制板(按键信号调理)、车身控制模块低功耗电路(需确认车载认证);
  4. 可穿戴设备:智能手表、手环的心率传感器信号调理、电池电量检测电路(小尺寸适配设备空间)。

六、选型与使用注意事项

为确保电路可靠性,需注意以下要点:

  1. 功率匹配:实际电路功耗需低于100mW,若功耗较高,需选择更大功率电阻(如0603封装1/16W);
  2. 精度验证:精密信号放大等场景需选择±1%或更高精度电阻;
  3. 焊接工艺:回流焊峰值温度240~260℃(时间≤10秒),避免过热损坏电阻层;
  4. 存储防护:存储环境温度-40~+85℃、湿度≤60%,贴装需ESD防护防止静电损坏。

总结

ERJ2GEJ471X作为松下通用型厚膜贴片电阻,以小尺寸、宽温稳定、高可靠性为核心优势,覆盖多领域低功耗电路需求,是工业与消费电子设计中的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.