WMSIC Electronic Components

ERA2AEB303X

ModelERA2AEB303X
Package0402
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERA2AEB303X
Type
PANASONIC
Minimum package
10000 圆盘

Technical parameters

Power
63mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERA2AEB303X
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.011g
Electronic Component
30kΩ
Electronic Component
1
Electronic Component
BM0264570361
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERA2AEB303X 薄膜贴片电阻产品概述

一、产品基本信息

ERA2AEB303X是松下(PANASONIC)推出的0402封装高精度薄膜贴片电阻,属于工业级/汽车级电阻系列。型号中“ERA2A”为核心系列标识,“EB”对应封装与功率等级,“303”为阻值代码(30×10³Ω=30kΩ)。该产品聚焦小型化、高稳定场景,是精密模拟电路、宽温环境设备的常用元件。

二、核心性能参数详解

关键参数直接决定应用适配性,具体解析如下:

  1. 阻值与精度:标称阻值30kΩ,精度±0.1%——属于“高精度级”,可满足模拟信号调理、射频匹配等场景对阻值一致性的要求,避免因偏差导致信号失真或功率损耗;
  2. 功率与电压约束:额定功率63mW,额定电压50V——实际使用需满足( P≤\frac{V²}{R} ),30kΩ下最大允许电压约43.5V(( \sqrt{30000×0.063} )),需以功率限制为核心;
  3. 温度系数(TCR):±25ppm/℃——远低于普通碳膜电阻(通常±500ppm/℃以上),例如温度从-55℃升至155℃(温差210℃),阻值漂移仅±0.525%,极端温度下性能稳定;
  4. 宽温工作范围:-55℃~+155℃——覆盖工业级、汽车级温度需求,适配户外通信、车载传感器等场景。

三、典型应用场景

基于参数特性,核心应用集中在精密与宽温环境:

  1. 工业控制:PLC模拟量输入模块、伺服驱动器电流采样电路——高精度保证信号准确,宽温适配车间温度波动;
  2. 汽车电子:车载传感器(胎压、氧传感器)信号调理、仪表盘驱动——汽车级温度范围完全覆盖,薄膜电阻抗振动性能优于碳膜;
  3. 医疗仪器:监护仪信号滤波、输液泵流量控制——±0.1%精度避免误判,低TCR保证环境温度下测量一致;
  4. 消费电子:高端音频前置放大、可穿戴传感器模块——0402封装体积小(1.0mm×0.5mm),适配小型化设计,低噪声适合音频处理。

四、品牌与封装优势

  1. 松下工艺保障:采用激光微调薄膜技术——通过激光刻蚀调整电阻膜厚度,实现高精度控制,薄膜结构抗老化性能比碳膜提升30%以上;
  2. 0402封装适配性:符合主流SMT产线贴装要求,支持高密度电路布局(如智能手机主板、服务器模块);
  3. 环保合规:符合RoHS 2.0、REACH标准,无铅封装,适配全球市场环保要求。

五、可靠性与质量验证

PANASONIC对该型号完成多维度可靠性测试:

  • 高温存储:155℃存储1000小时,阻值变化≤±0.1%;
  • 温度循环:-55℃~+155℃循环1000次,漂移≤±0.2%;
  • 振动测试:符合IEC 60068-2-6标准(10~2000Hz,98m/s²),无开路/短路故障。

这些测试验证了长期使用稳定性,满足工业级、汽车级质量要求。

总结:ERA2AEB303X以“小体积、高精度、宽温稳定”为核心优势,覆盖工业、汽车、医疗等多领域精密电路需求,是替代普通电阻的优选元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.