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ERJPA3F3301V
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERJPA3F3301V
- Type
- PANASONIC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 333mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERJPA3F3301V
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 3.3kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257349584
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERJPA3F3301V 产品概述
一、产品简介
ERJPA3F3301V 为松下（PANASONIC）ERJPA3 系列厚膜片式电阻，阻值为 3.3kΩ，精度 ±1%，封装为 0603（1608公制）。该器件适用于对体积与精度均有要求的消费电子、通信与工业控制等领域，提供稳定的电阻值与良好的温度特性。
二、主要特性
- 电阻类型：厚膜电阻
- 阻值：3.3kΩ（3301 表示 3.301k，常标称为 3.3k）
- 精度：±1%
- 额定功率：333mW（工作环境及散热条件影响实际可承受功率）
- 温度系数（TCR）：±100ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：0603（尺寸小、适合高密度贴装）
- 产商：PANASONIC（松下）
三、典型应用场景
- 移动和便携设备的分压、偏置网络
- 信号处理与滤波电路中的阻值匹配
- 通信终端与模块中的通用偏置与限流
- 工业电子设备、仪表和控制板上对体积与可靠性兼顾的设计
四、封装与可靠性说明
0603 尺寸使得该型号适合高密度贴片线路板（SMT）；厚膜工艺在温度循环、湿热与振动环境中表现稳定。工作温度达到 +155℃，适合较高温度应用，但在高温或散热受限的场合需关注功率降额与寿命影响。
五、设计与焊接建议
- 回流焊：建议遵循厂商提供的回流曲线或 J-STD-020 标准，避免超出峰值温度与时间，以防焊接应力损伤电阻体或电极。
- 功率降额：在高环境温度或周边元件密集时，应按制造商的降额曲线对额定功率进行保守处理；若无曲线建议在高温工况下减少实际负载功率以延长寿命。
- 测试与测量：测量时避免长时间通电以免自热影响阻值读数；使用四线或适当测量方法可提高测量精度。
- 储存与处理：避免潮湿和强腐蚀性环境，贴片过程中防止机械过压或刮擦。
六、选型提示与替代
选择时确认实际使用的功率裕量与热环境，若电路存在脉冲或高瞬态功率，应参照厂家数据或选用更高功率和更低 TCR 的型号。通用替代选项可选择同规格（0603、3.3kΩ、1%）的其他品牌厚膜片式电阻，但注意对比 TCR、额定功率与长期可靠性数据。
七、结论
ERJPA3F3301V 是一款适合高密度 SMT 应用的 0603 厚膜电阻，具有 ±1% 的精度和 ±100ppm/℃ 的 TCR，工作温度范围宽，适用范围广。设计时应关注散热与功率降额，以保证长期稳定可靠的运行。若需更严格的温漂或更高功率，应在选型时优先查看厂商详细规格书或考虑更高等级的器件。
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