WMSIC Electronic Components

ERA2AEB152X

ModelERA2AEB152X
Package0402
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERA2AEB152X
Type
PANASONIC
Minimum package
10000 圆盘

Technical parameters

Power
63mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERA2AEB152X
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.011g
Electronic Component
1.5kΩ
Electronic Component
1
Electronic Component
BM0264567892
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERA2AEB152X 薄膜贴片电阻产品概述

一、核心身份与基本定位

ERA2AEB152X是松下(PANASONIC) 推出的一款高精密小功率薄膜贴片电阻,属于其薄膜电阻系列的典型型号。该产品以0402超小型封装为核心特征,主打“高精密+低漂移+小体积”的组合优势,主要面向需要稳定信号处理、高密度电路设计的中高端电子设备领域,是替代常规精度电阻的理想选择。

二、关键电气性能参数

作为精密电阻,ERA2AEB152X的电气参数围绕“稳定性”与“精度”设计,核心参数如下:

  • 阻值与精度:标称阻值1.5kΩ(对应电阻代码“152”,即15×10²Ω),精度达±0.1%——远高于常规贴片电阻的±0.5%或±1%级别,可满足模拟电路中分压、限流等对阻值一致性要求严格的场景;
  • 功率与电压:额定功率63mW(0402封装的常规功率等级),最大工作电压50V;实际使用需同时满足功率/电压限制(实际功耗不超63mW,电压需结合阻值计算);
  • 温度系数(TCR):±25ppm/℃——温度每变化1℃,阻值仅变化±0.0375Ω(1.5kΩ×25×10⁻⁶),宽温环境下仍能保持阻值稳定,是精密电路抗温漂的关键特性。

三、封装与物理特性

ERA2AEB152X采用0402封装(英制尺寸,约1.016mm×0.508mm),是贴片电阻中体积最小的规格之一,具备以下优势:

  • 高密度适配:超小体积可大幅提升PCB布局密度,尤其适合智能手机、可穿戴设备等对空间要求苛刻的便携产品;
  • 自动化兼容:符合标准SMD工艺,可通过回流焊、波峰焊等自动化生产流程安装,适配大规模工业化制造;
  • 薄膜电阻结构:采用金属薄膜(如镍铬合金)作为电阻体,相比碳膜电阻具有更低噪声、更高稳定性,长期老化率更低。

四、适用场景与应用优势

结合参数特性,ERA2AEB152X的应用场景集中在“精密信号处理+小型化设备”两大方向,典型场景包括:

  1. 消费电子:智能手机/平板的传感器电路(加速度计、压力传感器信号调理)、可穿戴设备的低功耗模拟前端;
  2. 工业控制:小型PLC的模拟量输入模块、工业传感器的信号放大电路(阻值稳定抗干扰);
  3. 医疗设备:便携式监护仪的心率/血氧信号调理、小型医疗仪器的电压基准电路(低漂移保障精度);
  4. 通信设备:小型基站的射频辅助电路、光纤收发器的偏置电压控制(小体积适配高密度模块)。

其核心优势在于高精密与小体积的平衡——既解决常规电阻精度不足的问题,又未牺牲封装尺寸;同时松下的品牌可靠性,可降低终端产品售后风险。

五、可靠性与环境适应性

ERA2AEB152X针对宽温、恶劣环境优化,可靠性表现突出:

  • 宽温工作范围:支持-55℃+155℃,覆盖工业级(-40+85℃)及部分汽车级(-40~+125℃)场景,适应高低温交替的极端环境;
  • 抗干扰能力:薄膜电阻结构具备低噪声特性,减少电路热噪声与电磁干扰;松下封装工艺可抵御湿度、粉尘等外界影响;
  • 长期稳定性:经松下质量管控,1000小时高温老化后阻值变化控制在极小范围,适合对使用寿命要求高的设备。

综上,ERA2AEB152X以“高精密、小体积、宽温稳定”为核心竞争力,是松下针对中高端小型化电子设备的针对性产品,可满足多领域对精密电阻的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.