WMSIC Electronic Components

ERJ2RKF7503X

ModelERJ2RKF7503X
Package0402
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ2RKF7503X
Type
PANASONIC
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ2RKF7503X
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
750kΩ
Electronic Component
1
Electronic Component
BM0257349705
Operating Temperature
55℃~+155℃
Operating Voltage
100V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ2RKF7503X 贴片厚膜电阻产品概述

一、产品定位与核心参数

ERJ2RKF7503X是松下(PANASONIC)针对小型化、宽温适应性电路设计的厚膜贴片电阻,核心参数匹配中低功率、中等精度的应用需求。其关键参数如下:

  • 阻值:750kΩ(固定精度级)
  • 精度:±1%(满足多数工业/消费类电路的阻值偏差要求)
  • 额定功率:100mW(常温25℃下连续工作功率,功耗余量充足)
  • 工作电压:100V(耐压覆盖常见中低电压系统)
  • 温度系数:±100ppm/℃(温度波动对阻值影响可控)
  • 工作温度范围:-55℃至+155℃(宽温环境适应性)

二、封装与物理特性

该电阻采用0402封装(英制命名,对应公制1005尺寸:长1.0mm×宽0.5mm×高0.35mm),是贴片电阻中尺寸较小的规格之一,具备三大优势:

  1. 高密度布局适配:可显著缩小电路体积,满足智能手机、可穿戴设备等小型终端的空间限制;
  2. 自动化生产兼容:支持回流焊、波峰焊等标准贴片工艺,量产效率高,焊接缺陷率低;
  3. 无引脚结构稳定:表面贴装设计减少机械应力,提升长期可靠性。

三、电气性能详解

3.1 阻值精度与信号稳定性

±1%的阻值精度属于厚膜电阻的中等精度等级,可满足信号调理、分压限流等场景的精确需求。例如在模拟放大电路中,该电阻与其他元件配合可实现稳定的增益控制,避免因阻值偏差导致的输出信号偏移。

3.2 功率与耐压能力

100mW额定功率为常温下的连续工作功率,环境温度升高时需参考松下官方降额曲线,但155℃高温下仍可保持部分功率输出(如60℃时功率降额至80mW左右)。100V工作电压覆盖5V、12V、24V等常见电源系统,无需额外串联保护电阻,简化电路设计。

3.3 温度系数的实际价值

±100ppm/℃的温度系数意味着:温度变化100℃时,阻值仅变化750kΩ×100ppm=75Ω(仅为±1%精度的1/100),温度波动对电路性能的影响可忽略,尤其适合宽温环境下的稳定工作。

四、环境适应性

该电阻的宽温工作范围(-55℃~+155℃) 是核心优势,可覆盖以下场景:

  • 工业控制:车间温度波动、户外传感器节点;
  • 汽车电子:发动机舱附近高温环境(部分区域≥120℃);
  • 极端气候终端:低温地区户外设备、高温地区手持终端。

此外,厚膜电阻的陶瓷基底与厚膜层结合强度高,具备较好的抗振动、耐湿能力:表面涂覆保护层可防止潮气侵入,符合IEC 60068-2-6振动测试标准(10~2000Hz,加速度1g)。

五、典型应用场景

结合参数特性,ERJ2RKF7503X适用于四大领域:

  1. 小型消费电子:智能手机音频分压、可穿戴设备传感器信号调理;
  2. 工业控制:PLC输入输出接口限流、温度传感器分压网络;
  3. 汽车电子:车载显示屏背光控制、车身控制器信号检测;
  4. 医疗设备:便携式监护仪低功耗信号处理(符合RoHS环保标准)。

六、品牌与可靠性保障

松下作为全球知名厂商,其厚膜电阻具备三大可靠性优势:

  • 批次一致性:量产阻值偏差、温度系数一致性高,减少电路调试难度;
  • 长期稳定性:通过1000小时高温负载测试(阻值变化率≤0.5%)、高温存储测试(155℃×1000小时);
  • 环保合规:符合RoHS、REACH标准,无铅无镉,适配绿色制造需求。

总结:ERJ2RKF7503X凭借小封装、宽温适应性、稳定电气性能,成为小型化电子设备中中低功率电阻的高性价比选择,尤其适合对空间和环境温度有严格要求的应用场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.