WMSIC Electronic Components

ERJ3EKF3402V

ModelERJ3EKF3402V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJ3EKF3402V
Type
PANASONIC
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJ3EKF3402V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
34kΩ
Electronic Component
1
Electronic Component
BM0257349697
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJ3EKF3402V 松下厚膜贴片电阻产品概述

一、产品核心身份与定位

ERJ3EKF3402V是松下电子推出的工业级厚膜贴片电阻,属于ERJ3E系列中0603封装的中功率高精度型号。该产品针对小型化、高可靠性需求设计,兼具成本优势与性能稳定性,覆盖消费电子、工业控制、通信等多领域,是量产级被动元件的典型代表。

二、关键电气性能参数详解

该电阻的核心参数精准匹配中低功耗高精度场景,具体如下:

  • 阻值与精度:标称阻值34kΩ(代码“3402”对应34×10²Ω),精度±1%,满足信号调理、分压电路等对阻值一致性的要求;
  • 功率与电压:额定功率100mW(0603封装常规功率等级),额定工作电压75V。需注意:实际应用需同时满足“功率≤100mW”与“电压≤75V”,例如34kΩ时最大允许电压约58.3V(由P=U²/R推导),需以功率限制为准;
  • 温度系数:±100ppm/℃,即温度每变化1℃,阻值漂移±0.01%。若环境温度从25℃升至125℃(变化100℃),阻值最大漂移±1%,符合工业级环境的稳定性需求;
  • 工作温度范围:-55℃~+155℃,覆盖极寒、高温等恶劣工况,适配汽车辅助系统、工业传感器等场景。

三、物理封装与工艺特性

1. 封装规格

采用0603封装(英制代码,公制尺寸1.6mm×0.8mm×0.45mm),体积小巧,适合高密度PCB设计,支持回流焊、波峰焊等常规贴片工艺。

2. 厚膜工艺优势

  • 陶瓷基底:采用高纯度氧化铝陶瓷,热稳定性好,减少温度对电阻膜的影响;
  • 电阻膜:通过丝网印刷+高温烧结形成厚膜电阻层,阻值一致性高,长期使用漂移小;
  • 终端电极:松下采用“镍阻挡层+无铅锡镀层”(符合RoHS标准),焊接可靠性强,抗硫化、氧化性能优于普通电极。

四、典型应用场景

ERJ3EKF3402V的性能适配多领域低功耗高精度电路,典型应用包括:

  • 消费电子:手机/平板的信号滤波分压、传感器接口偏置电阻;
  • 工业控制:PLC输入输出接口限流、小型电机驱动的电流检测分压;
  • 通信设备:小型基站射频匹配电路、电源模块的电压采样电阻;
  • 汽车电子:车载辅助系统(如胎压监测)的低功耗信号调理电路(宽温范围已覆盖部分需求);
  • 医疗设备:小型诊断仪器(如血糖仪)的信号放大偏置电阻。

五、可靠性与环境适应性

松下对该产品的可靠性测试符合JIS C 5201、IEC 60115等标准,核心可靠性指标包括:

  • 湿热稳定性:通过85℃/85%RH环境下1000小时测试,阻值变化≤±1%;
  • 机械强度:抗振动(10~2000Hz,加速度1.5g)、冲击(1000m/s²,持续1ms)性能满足移动设备需求;
  • 长期稳定性:常温下2000小时老化测试,阻值漂移≤±0.5%,适合长期运行的工业设备。

六、选型与应用注意事项

  1. 功率/电压匹配:实际功耗需≤100mW,避免过载导致阻值漂移;若电路电压接近75V,需确认电阻实际功率是否超额定值;
  2. 焊接工艺:回流焊峰值温度控制在240~250℃(时间≤30秒),避免过热导致陶瓷基底开裂;
  3. 存储条件:未焊接电阻需存储在湿度≤60%RH、温度0~40℃的环境,避免长期暴露在潮湿中导致电极氧化;
  4. 精度验证:批量使用前建议抽样测试阻值一致性,确保符合±1%精度要求。

该产品凭借松下的工艺积累与参数优势,成为中小功率高精度贴片电阻的高性价比选择,广泛应用于对可靠性、一致性有要求的量产场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.