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ERA3VEB1000V
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERA3VEB1000V
- Type
- PANASONIC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERA3VEB1000V
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±0.1%
- Electronic Component
- 0.03g
- Electronic Component
- 100Ω
- Electronic Component
- 1
- Electronic Component
- BM0257349668
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 100V
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERA3VEB1000V 薄膜贴片电阻产品概述
一、产品核心定位与应用场景
ERA3VEB1000V是松下针对小体积精密电路打造的薄膜贴片电阻，聚焦“高密度布局+高稳定性+低阻值误差”三大设计需求，广泛适配工业控制、医疗设备、消费电子及汽车电子等领域。其核心价值在于用0603封装实现高精度、宽温域的性能平衡，解决传统贴片电阻“小体积难兼顾精度/功率”的痛点。
二、关键参数与性能优势
该型号的核心参数可支撑多数精密电路的稳定运行，关键优势如下：
- 高精度：阻值100Ω±0.1%——满足医疗监护仪、工业传感器等对阻值误差<0.1%的严苛要求；
- 低温度漂移：温度系数±25ppm/℃——温度在-55℃~+155℃波动时，阻值变化极小（如100℃温差下，阻值漂移仅±0.25Ω），避免信号失真；
- 功率密度高：125mW额定功率（0603封装下功率密度超同类产品15%），配合100V最大工作电压，覆盖中低功率精密负载；
- 宽温可靠性：工作温度覆盖-55℃至+155℃——适应工业现场极端温度（如户外传感器、汽车发动机舱电路）。
三、封装与工艺可靠性设计
采用0603英寸贴片封装（公制1608），体积仅1.6mm×0.8mm，适配高密度PCB布局（如智能手机主板、小型PLC）。松下特有的真空沉积薄膜工艺确保：
- 抗机械应力：符合IEC 60068-2-6（振动）、IEC 60068-2-27（冲击）标准，可承受工业环境中的机械振动；
- 长期稳定性：1000小时高温负载老化后，阻值变化率≤0.1%，适合医疗设备等长期可靠运行场景；
- 环保兼容：符合RoHS、REACH标准，无铅焊接兼容回流焊/波峰焊工艺，焊接后引脚无虚焊风险。
四、典型应用场景与案例
- 工业自动化：传感器信号调理电路（如压力传感器分压），利用±0.1%精度保证信号采集误差<0.1%；
- 医疗设备：监护仪心率/血氧放大电路，宽温范围适应医院不同环境，稳定性能避免误诊；
- 消费电子：高端音频前置放大电路，低温度漂移减少音频失真（THD+N可降至0.001%以下）；
- 汽车电子：辅助驾驶雷达接口电路，-55℃~+155℃宽温适应发动机舱、冬季户外等场景。
五、选型与使用注意事项
- 功率降额：高温环境（>125℃）需按松下降额曲线调整实际功率（如125℃时降额至70%），避免过热失效；
- 电压限制：实际工作电压不得超过100V（峰值），防止电阻击穿；
- 焊接规范：回流焊峰值温度220℃~260℃，时间≤10秒，避免损坏电阻膜；
- 储存条件：未开封产品储存在15℃35℃、湿度40%60%环境，开封后1个月内使用，防止引脚氧化。
该型号凭借松下成熟的薄膜工艺与严格的可靠性测试，成为精密电子设计中“小体积、高精度”需求的经典选型，广泛应用于全球主流电子厂商的终端产品中。
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