Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ERJ2RKF20R0X
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERJ2RKF20R0X
- Type
- PANASONIC
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERJ2RKF20R0X
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.011g
- Electronic Component
- 20Ω
- Electronic Component
- 1
- Electronic Component
- BM0257349672
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
松下ERJ2RKF20R0X精密厚膜贴片电阻产品概述
一、产品基本信息
ERJ2RKF20R0X是松下（PANASONIC）推出的精密级厚膜贴片电阻，属于其常规精密电阻系列中的典型型号。该产品采用厚膜工艺制造，定位为中小功率精密电路的信号调理、滤波及分压等场景，以高一致性、宽温稳定性为核心特点，适配多种电子设备的小型化设计需求。
二、核心电气参数详解
该型号的关键电气参数直接决定应用适配性，需重点关注以下四点：
- 阻值与精度：标称阻值20Ω，精度±1%——相比普通贴片电阻±5%的精度，能更精准控制电路电流、电压分配，满足精密信号调理需求；
- 功率额定值：100mW（0.1W）——符合0402封装的功率上限，适配低功耗电路、小信号传输路径，避免功率冗余浪费；
- 温度系数（TCR）：±100ppm/℃——即每变化1℃，阻值变化量不超过20Ω×100×10⁻⁶=0.002Ω，高低温下阻值漂移极小；
- 工作温度范围：-55℃+155℃——覆盖工业级温度区间，比商业级（0℃70℃）宽近一倍，可在极端环境（如户外设备、车载低温场景）可靠工作。
三、封装与物理特性
该产品采用0402封装（英制代码，对应公制尺寸1.0mm×0.5mm），是贴片电阻中常见的小型化封装，物理特点如下：
- 基底为陶瓷材料，耐高温、绝缘性好，适配回流焊等表面贴装工艺；
- 厚膜工艺通过丝网印刷电阻浆料并烧结而成，相比薄膜电阻成本更低，同时保证精度与稳定性；
- 尺寸紧凑，每平方厘米PCB可贴装近千个该电阻，适合智能手机、智能穿戴等高密度贴装需求。
四、典型应用场景
基于参数特性，ERJ2RKF20R0X主要适用于以下场景：
- 消费电子：智能手机传感器信号调理（如加速度计分压）、智能手表低功耗电源滤波；
- 工业控制：小型PLC输入输出模块、传感器节点信号放大辅助电路；
- 通信设备：小型基站射频前端滤波、路由器电源稳压分压网络；
- 汽车电子（部分）：车载中控屏背光控制、胎压监测模块信号调理（需确认整车级认证，温区覆盖符合部分车载需求）。
五、产品核心优势
相比同封装普通厚膜电阻，该型号优势突出：
- 精度与稳定性平衡：±1%精度+±100ppm/℃ TCR，兼顾精密控制与成本；
- 宽温可靠性：-55℃~+155℃温区，高低温循环阻值漂移极小；
- 品牌工艺保障：松下成熟工艺确保批量一致性，降低电路调试难度；
- 小型化适配：0402封装匹配100mW功率，完美适配设备轻薄化趋势。
总结
ERJ2RKF20R0X作为松下精密厚膜贴片电阻代表型号，以平衡的精度、宽温稳定性和小型化优势，成为多类电子设备常规精密电路的理想选择——既适配消费电子高密度贴装，也支撑工业级环境可靠工作，是兼顾性能与成本的实用器件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
