WMSIC Electronic Components

ERJPA2F4701X

ModelERJPA2F4701X
Package0402
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERJPA2F4701X
Type
PANASONIC
Minimum package
10000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERJPA2F4701X
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
4.7kΩ
Electronic Component
1
Electronic Component
BM0264570390
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERJPA2F4701X 厚膜贴片电阻产品概述

ERJPA2F4701X是松下(PANASONIC)针对小体积、高可靠性电子电路推出的0402封装厚膜贴片电阻,核心用于限流、分压、滤波等基础功能,广泛覆盖消费电子、工业控制、通信等领域。以下从多维度展开详细概述:

一、产品基本属性

ERJPA2F4701X属于松下厚膜贴片电阻系列,型号命名遵循行业通用逻辑:

  • ERJP:松下厚膜贴片电阻系列标识;
  • A2:功率等级(对应250mW额定功率);
  • F:精度等级(对应±1%阻值精度);
  • 4701:阻值代码(470×10¹=4.7kΩ);
  • X:封装后缀(明确0402封装)。

该产品主打小体积、高精度、宽温适应三大核心优势,适配自动化SMT生产流程,是电子设备小型化趋势下的主流选型。

二、核心性能参数详解

ERJPA2F4701X的参数针对不同场景做了针对性优化,关键参数及应用意义如下:

参数类型 具体数值 应用价值 标称阻值 4.7kΩ(4701) 适配多数电路的分压、限流需求(如ADC输入网络、电源反馈回路) 阻值精度 ±1% 高于常规±5%电阻,确保传感器信号调理、电压基准等场景的精准度 额定功率 250mW 匹配0402封装功率上限,满足手机、IoT设备等小功率电路的负载要求 最大工作电压 50V 耐受电路瞬态过压,降低设备损坏风险 温度系数(TCR) ±100ppm/℃ 温度变化1℃时阻值漂移≤0.01%,适合宽温环境下的阻值稳定性需求 工作温度范围 -55℃~+155℃ 覆盖工业级(-40+85℃)及汽车辅助电路(-55+125℃)的温度场景

三、封装与工艺特点

1. 0402封装:小体积高密度

封装尺寸为1.0mm×0.5mm(英制规格),是贴片电阻中体积较小的类型之一,可大幅节省PCB空间,适配智能手机、智能穿戴、小型医疗设备等对体积敏感的产品。

2. 厚膜工艺:稳定耐用性强

采用丝网印刷+高温烧结厚膜工艺,相比薄膜电阻成本更低,相比碳膜电阻稳定性更强:

  • 耐机械冲击:适配批量SMT生产中的搬运、焊接冲击;
  • 抗环境腐蚀:厚膜层致密,可抵御潮湿、粉尘等环境影响;
  • 长期可靠性:额定参数下使用,阻值漂移率≤0.1%/1000小时。

3. 焊盘设计:适配自动化生产

焊盘采用优化结构,兼容回流焊、波峰焊工艺,焊接后附着力强,降低虚焊风险,提升生产良率。

四、典型应用场景

ERJPA2F4701X的性能适配多领域需求,典型应用包括:

1. 消费电子领域

  • 手机/平板:电源管理模块的电压反馈分压、屏幕背光驱动限流;
  • 智能穿戴:手环/手表的传感器信号调理、低功耗电路电阻网络。

2. 工业控制领域

  • PLC可编程控制器:输入输出接口限流、信号滤波;
  • 传感器模块:温度/压力传感器的信号分压(如4-20mA电流环采样电阻)。

3. 通信设备领域

  • 路由器/交换机:电源电路限流、以太网接口阻抗匹配;
  • 基站设备:射频前端辅助电阻(需结合其他器件)。

4. 小型医疗设备

  • 血糖仪/血压计:信号放大电路分压、电源稳压回路电阻。

五、可靠性与环境适应性

1. 宽温稳定性能

-55℃~+155℃的工作温度范围,可满足极端环境需求:如北方户外设备(冬季低温)、工业烤箱附近控制电路(夏季高温)。

2. 长期可靠性验证

松下对该产品完成多项可靠性测试:

  • 高温负载测试(+155℃,250mW负载):阻值变化≤0.5%;
  • 温度循环测试(-55~+155℃,1000次循环):性能无衰减;
  • 耐湿测试(85℃/85%RH,1000小时):阻值漂移≤0.2%。

3. 环保合规

符合RoHS 2.0、REACH等国际环保标准,无铅无镉,适配全球市场准入要求。

六、品牌与品质保障

ERJPA2F4701X依托松下全球品质管控体系:

  • 生产工艺标准化:所有批次采用相同参数,一致性强;
  • 批量供应稳定:年产能充足,满足OEM/ODM客户大规模订单;
  • 技术支持完善:提供电路设计参考、失效分析等售后支持,降低研发风险。

综上,ERJPA2F4701X是一款高性价比、高可靠性的厚膜贴片电阻,适配小体积、宽温、高精度电子电路需求,是电子设备小型化升级的理想选择。

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