WMSIC Electronic Components

EVQPLHA15

ModelEVQPLHA15
PackageSMD,4.9x4.9mm
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC EVQPLHA15
Type
PANASONIC
Minimum package
5000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
EVQPLHA15
Electronic Component
1
Package
SMD,4.9x4.9mm
Electronic Component
Switch
Electronic Component
0.904g
Electronic Component
1.6N
Electronic Component
1
Electronic Component
BM0257240724
Electronic Component
Electronic Component
Electronic Component
50
Operating Temperature
20℃~+70℃
Switch
4.9mm
Switch
4.9mm
Switch
1.5mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EVQPLHA15 产品概述

EVQPLHA15 是松下(PANASONIC)系列中的一款低高度表面贴装圆形按键微动开关,属于单刀单掷(SPST)触觉开关。该器件以紧凑的外形、可靠的触点寿命和适合表面贴装工艺的封装,常用于便携设备、消费类电子和控制面板等需要低行程、稳定触感的场景。

一、主要特性

  • 类型:微动触觉开关(TACT switch),单刀单掷(SPST),常开/常闭请根据具体型号确认。
  • 外形:圆形按钮,尺寸紧凑,SMD 立贴安装。
  • 外形尺寸(封装):4.9 mm x 4.9 mm,厚度约 1.5 mm。
  • 操作力:1.6 N(约 160 gf),适中触感,适合短行程快速响应。
  • 额定电气参数:20 mA / 15 VDC(0.02A/15VDC)。
  • 引脚样式:J 型引脚(用于表面贴装的 J-lead 设计)。
  • 工作温度范围:-20 °C 至 +70 °C。
  • 工作寿命:典型寿命 500,000 次动作(视应用条件而异)。
  • 包装形式:SMD、常见为卷带包装(详见供应商资料)。

二、结构与尺寸要点

EVQPLHA15 采用扁平、低矮的 SMD 封装,边长 4.9 mm、厚度 1.5 mm,适合对高度有限制的产品设计。圆形按键设计便于实现集中按压点,J 型引脚有利于在回流焊后形成良好焊锡过渡并减轻机械应力传递到开关本体。

注:Pos:2 为产品型号代码的一部分,代表厂商对该系列中某一定位/行程类型的标识。具体含义请参照松下器件数据手册或向供应商确认。

三、电气性能

  • 触点电流/电压:0.02 A / 15 VDC(用于低电流信号开关场合)。
  • 适用场景:低电流信号检测、控制按键、状态触发等。非设计用于高电流或高电压载流场合。
  • 接触材料与接触电阻等详细电气参数,请参考厂商规格书以获得测试条件下的典型值与最大值。

四、机械性能与可靠性

  • 操作力 1.6 N 提供明确的触觉反馈,适合手指或薄膜按键结构配合使用。
  • 使用寿命 50 万次,表明在频繁按压的产品中可提供长期稳定的机械与电气性能。
  • 环境耐受:推荐工作温度 -20 °C 至 +70 °C,适合多数室内消费电子及工业轻应用,但不适用于极端高温或深冷环境。
  • 机械安装时应避免对开关本体施加横向或弯曲应力(尤其在回流焊后),以免影响寿命或导致误动作。

五、封装与贴装建议

  • PCB 布局:采用厂商推荐的焊盘与过孔/焊盘尺寸,保证 J-lead 的焊锡裙边形成可靠焊点并留有足够焊锡量。
  • 回流焊:推荐遵循通用无铅回流工艺曲线(峰值 245–260 °C,具体参数请依据 PCB、助焊剂与元件承受能力调整)。
  • 清洗与保护:回流后若需清洗,请使用与开关兼容的清洗剂并避免长时间浸泡或强力超声清洗。
  • 机械固定:若产品在使用中会受到较大外力冲击,应在 PCB 设计或结构上增加支撑或固定结构,防止开关在外力作用下移位或破损。

六、典型应用场景

  • 手持设备、遥控器与便携仪器的功能按键。
  • 消费电子(音视频设备、家电控制面板)的菜单或确认键。
  • 工业设备的面板按键、设置/复位按键(在符合电气负载范围内)。
  • 需要薄型化、耐用按键的可穿戴或移动终端。

七、选型与使用注意事项

  • 电流、电压需求:EVQPLHA15 额定为 20 mA / 15 VDC,仅用于信号级别的开关应用;若系统中存在更高电流或电压,应选用更高额定值或在开关前串接继电器/驱动器。
  • 环境适配:若应用场景存在水汽、灰尘或化学腐蚀性气体,需评估开关的密封等级或选择具备防护结构的型号。
  • 触感与行程:1.6 N 的操作力对应中等偏轻触感,若需更轻或更重的触感可参考系列中其它操作力选项。
  • 供货与验证:采购与设计前请索取官方数据手册与样品进行可靠性验证(包括焊接兼容性、环境试验与寿命测试)。

若需进一步的 CAD 封装图、PCB 焊盘尺寸、回流焊温度曲线或与替代型号对比,我可以根据您提供的系统要求(PCB 材料、生产工艺、使用环境)给出更具体的建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.